Electronics Forum | Mon Dec 02 20:53:29 EST 2002 | davef
Gerber[R] Data (File). Used in directing a photoplotter during printed circuit board and stencil artwork fabrication. Gerber Scientific Instrument Company used to be the dominant producer of the photoplotters used for "shooting" film, back when mec
Electronics Forum | Thu Sep 20 15:02:36 EDT 2007 | pjc
You do not always need test points designed on the board. Any ICT supplier will consult with you on that and after looking at your designs. Teradyne offers new and refurb'd systems for ICT, analog only or w/ Vectorless testing to ensure ICs have a co
Electronics Forum | Wed Jun 27 11:59:55 EDT 2007 | samir
*Preheat zone *Maximum slope is a time/temperature relationship that measures how fast the temperature on the printed circuit board changes. The ramp�up rate is usually somewhere between 1.0 �C and 3.0 �C per second, often falling between 2.0 �C and
Electronics Forum | Mon Feb 12 21:38:38 EST 2007 | DEK Answer Guy (PR Dept)
Technical Papers) -ProFlow� upgrades (MPU's). -Paste Low Optimisation -Adjustment of the Print Carriage to ensure Squareness to the Stencil -Replacement of Hinge Pin Assembly -Conversion of ProFlow� to Horizontal Mount -ProFlow� Guides for Operators
Electronics Forum | Tue Nov 01 14:46:31 EDT 2011 | davef
Agilent TestJet Technology White Paper In the early 1990s, the testing of digital parts became problematical. Previous in-circuit test techniques sought to ensure a correct, functioning part by applying digital patterns, called vectors, to the input
Electronics Forum | Thu Dec 03 13:24:12 EST 1998 | Russ M
| | | Does anyone have any information or experience with the use of conductive epoxy in leu of solder. I have a unique application that might lend itself to this technology. I am looking for manufacturers, printing, curing and reliability info. | |
Electronics Forum | Sat Nov 22 09:27:18 EST 2008 | davef
IPC-HDBK-001 w/Amendment 1 Handbook and Guide to Supplement J-STD-001 (Includes J-STD-001B to C Comparison). During fabrication and storage, both components and PWBs will often absorb water. If left in the device, this water will vaporize at solderi
Electronics Forum | Fri Dec 04 13:25:34 EST 1998 | Jeff Sanchez
| | | | Does anyone have any information or experience with the use of conductive epoxy in leu of solder. I have a unique application that might lend itself to this technology. I am looking for manufacturers, printing, curing and reliability info. |
Electronics Forum | Thu Jul 13 22:20:38 EDT 2000 | Dave F
=10 mils larger than lead 3 silk screen legend text weight >=10 mils 4 pads >=15 mils larger than finished hole sizes 5 place through hole components on 50 mil grid 6 no silk screen legend text over vias (if vias not solder masked) or holes 7 so
Electronics Forum | Thu Oct 04 00:01:59 EDT 2018 | gaintstar
Flason SMT FUJI Pick and Place Machine: http://www.flason-smt.com/product/FUJI-Chip-Mounter-SMT-spare-parts-A10395-Fiber-Amplifier.html http://www.flason-smt.com/product/FUJI-Chip-Mounter-SMT-spare-parts-Amplifier-A1038t.html http://www.flason-smt.co
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