Electronics Forum: via fill problem (Page 1 of 80)

conductive fill via

Electronics Forum | Mon Nov 11 02:28:27 EST 2002 | Melvin

I want to make a double-sided PCB. the process include conductive filling via for RF guarding. Does anyone can tell me where I can do it?

conductive fill via

Electronics Forum | Mon Nov 11 11:28:32 EST 2002 | davef

Sand is not a great conductor, compared to copper. Never heard of using the stuff on RF boards. Our board fabricator uses Dupont CP100, now CP101, [or something like that cuse who's going to check?] when plugging via on cheap boards. Your board fa

via capping

Electronics Forum | Mon Jan 11 14:48:44 EST 2010 | davef

SR1000 is commonly used for tenting. Search the fine SMTnet Archives on : tenting Someone gave us this note. We have lost their name. It seems to be good advice. If Liquid Photo Image (LPI) solder mask is required, do not tent via holes. Tenting

via as test point

Electronics Forum | Mon Feb 26 20:02:42 EST 2001 | davef

First, I don�t understand why your board fabricator can�t do a good job plugging your vias. Additionally, when you consider that they forgot to plug the first batch of boards, it makes me wonder if they are desirable as a supplier. Generally, we us

Re: via hole plugging

Electronics Forum | Thu May 20 07:53:55 EDT 1999 | Chris Nuttall

| | We care currently running into problems during our plug via process: | | At the moment we plug prior to soldermask (LPISM) using epoxy resin - plugging takes place from the component side - however we are seeing solderballs after solder level.Thi

Vertical fill solder

Electronics Forum | Thu Sep 08 08:54:09 EDT 2005 | Slaine

if the problem is wetting change the flux type. have you tried adjusting the temperature of the wave? if your getting 100% wetting id decrease the wave temperature, or try a flux that is less active.

via capping

Electronics Forum | Wed Jan 27 20:11:36 EST 2010 | plerma

What material is used to cap a via? Is it the > standard LPI Process/Material? we tent vias all the time, mostly to assist with assembly and the majority of the time outgassing is not a problem. What is the purpose in your case?

Filling via holes during the reflow process

Electronics Forum | Mon Mar 04 17:52:59 EST 2002 | davef

Yes, providing the surface of the via is solderable. * If so, how much paste? => Vias come in various sizes. Boards vary in thickness. So, the amount of paste to fill a via varies. Roughly, you�ll need twice as much paste as the volume of the via

Solder flow thru via on pad

Electronics Forum | Tue Sep 25 14:08:59 EDT 2001 | davef

Oooo, the solder on the pad and PGA ball is flowing during reflow down the via to the secondary side? Why didn�t you say so?? ;-) Why would you expect that gravity and capillary action wouldn�t force solder to flow down the solder plated via to the

Filling via holes during the reflow process

Electronics Forum | Tue Mar 05 22:34:27 EST 2002 | YoYo

You better be careful how you plug vias at screenprint - we currently have a customer that wants vias plugged, so we had a 2% aperature reduction so we would not have to much paste, I believe it should have been reduced more because some of the solde

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