Electronics Forum | Thu Jun 02 08:42:06 EDT 2016 | emeto
Several important things to watch. 1. More paste can result in more voiding(I usually shoot for 50-65% coverage) 2. Make a different grid(windowpane) for you pad - try with more smaller windows 3. Try both ramp to spike or Soak profiles and see whic
Electronics Forum | Thu Jun 02 22:40:13 EDT 2016 | slouis2014
Hi, yes have a few experiments initially i tried to increase the solder volume but component pin have insufficient solder. 1. The solder coverage do you calculate it by solder volume or solder area. 2. if i would achieve as you recommend 50-60 % woul
Electronics Forum | Fri Jun 20 03:47:24 EDT 2008 | philip
Hi all, any good recommendation for PbF paste application to reduce voids underneath the QFN thermal pad (stencil thickenss? opening? via hole? reflow profile etc)? We have tried few stencil opening design but no significant improvement as seen. Ther
Electronics Forum | Tue Oct 01 15:48:56 EDT 2002 | lysik
No problem. A standard stencil is OK. You want to print a half moon shape on each side of the hole. Make sure you print about X2 the size of your hole and make sure you keep the print in close to the hole. You want to print X2 the hole size as to hav
Electronics Forum | Tue Jul 18 21:48:15 EDT 2006 | davef
We assume by "solder hole" you mean void. We believe void formation is driven by the thermal recipe that you've chosen to use. Search the fine SMTnet Archives for further discussion. There is a tremendous amount of current industry discussion on v
Electronics Forum | Tue Oct 27 16:22:00 EDT 2009 | davef
It's not the first thing we think of in looking at your picture. First off, the lack of copper in the region of the red oval makes us think of a plating defect. We don't expect that moisture out-gassing through the barrel wall to show-up on opposite
Electronics Forum | Mon Jan 24 06:19:04 EST 2011 | fönsi
Hello! I've had the same problem about one Jear ago. We had exessive building of voids in the solder joints. I recomment to take a pincer to break off some of the components. If the solder joint is good, the copper pad will stay at the solder joint
Electronics Forum | Tue Jun 26 15:40:12 EDT 2012 | ssupertuba
Hello there, I'm presently experiencing some blow holes and solder voids in the solder fillet of caps on boards. They are ceramic caps. The solder is SAC105 and the parts range from 33pf to 0.1uf ceramic. Any suggestions?
Electronics Forum | Wed Nov 14 10:51:34 EST 2007 | mumtaz
Yes. Baking boards is best. Hitting the hamer on the head!
Electronics Forum | Wed Jun 27 21:56:31 EDT 2012 | davef
I'm spinning on this. Are we talking PTH or SMT?
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