Electronics Forum | Tue Jul 15 21:04:17 EDT 2003 | Thomas
It is for an evaluation run for wafer bumping....Well guys any recommendation for the profile ??
Electronics Forum | Mon Sep 28 12:55:37 EDT 1998 | Manish Ranjan
Hi Everyone Does anyone has any insight regarding the void formation in the solderbumps during wafer bumping by electroplating. Someone told me that it could be mainly coz of the alloy concentration being incorrect. Any suggestions, corrective action
Electronics Forum | Mon Jun 05 05:41:48 EDT 2000 | casi
I need to find info about testing and probe contact about wifers with bump on pads. Thanks a lot to everybody that helps me
Electronics Forum | Fri Nov 10 12:22:12 EST 2000 | casi
I'm interested in probes for wafer testing made in verted. I need to tested wafers with pad with flat gold bumps ( 17um ) with pitch = 70um. I'm also interested in every web site related on gold bumps testing. Thanks a lot !!! Casi
Electronics Forum | Thu Jun 03 17:24:03 EDT 1999 | Steve A
| Hi everybody, | | Somebody know the advantages of electroformed stencils on laser cut stencils ? | | any coment is apreciated. | | | thanks | | Al | Hey Al, An Electroformed (an additive process) stencil is comparable quality wise as a laser
Electronics Forum | Tue Feb 02 08:37:32 EST 1999 | Chris G.
| Hello Everybody: | | I am in urgent need of some information regarding the reflow profile for a flip chip wafer. Would the reflow conditions along with the flux used affect the appearence of the solder joints. | | We are witnessing dull solder j
Electronics Forum | Tue Dec 21 20:05:01 EST 1999 | Chris
Try Flip Chip Technologys. They have several daisy chain flip chips. One is called FP250. .250 X .250 solder bumped flip chip. Try Technet too. Remember seeing several other manufactures of daisy chain die. Maybe Unitive at www.unitive.com can
Electronics Forum | Tue Feb 24 01:19:01 EST 1998 | Jon Gruett
You are right !!! The exact volume of solder paste onto flip chips is extremely critical. Only one vendor that I know has taken that part of the process to the next level, whereby they can effectively deposit the right amount onto the flip chip exa
Electronics Forum | Tue Nov 05 09:21:18 EST 2002 | stefwitt
After all, you may want to consider a Flip Chip process. The chips are bumped with tiny solder balls while still on the wafer. You may present the bumped chips in Gel Pack, trays or Surftape to your Pick $ Place machine ( if capable for Flip Chip pl
Electronics Forum | Fri Apr 22 05:01:19 EDT 2011 | azrina
Hi, I am doing my master degree in flux cleaning process for flip chip assemblies and required to establish a new receipt for flux cleaning. currently, i am doing screening process for the parameters involve ; temp,pressure, surfactants, speed and a
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