Electronics Forum | Thu Aug 09 01:05:03 EDT 2012 | sajith09
I would like to understand What will be the allowable warpage for 152mm length PCB. We are observing about 1.5mm warpage. Is that acceptable? Could you please share method to calculate the warpage
Electronics Forum | Thu Aug 09 07:53:16 EDT 2012 | davef
Allowable bow & twist: Together, both IPC-A-600G and IPC-6012B represent the core IPC documents for describing the acceptable and nonconforming conditions that are either externally or internally visible on finished printed boards. IPC-A-600G relies
Electronics Forum | Thu Aug 18 06:06:07 EDT 2016 | technotronix
Here is a PCBA Warpage calculate method after complete SMT/Through hole assembly Warpage calculation method = warping height / length of the curved edge
Electronics Forum | Wed Aug 17 06:30:50 EDT 2016 | thaneshsivanadian
Hi Guys, i have some doubt, may i know how to calculate the PCBA warpage after complete of SMT and through hole process? Do we have any calculation for that? And What is the acceptance level of warpage after complete assembly? Thanks, Thanesh
Electronics Forum | Thu Apr 07 10:58:01 EDT 2005 | Dhanish
Need help from the experts on 1)simple way to measure the PCB warpage 2)what is the maximum warpage can the SMT machine allow the to accept and place the component without problem. 3)I have seen some people are using 7mils/inch as a Warpage spec. a
Electronics Forum | Wed Aug 17 17:17:45 EDT 2016 | davef
Warpage of a completed assembly is an uncommon requirement. I would ask whoever is laying that requirement on you to define how they would like you to measure it.
Electronics Forum | Thu Apr 07 20:16:23 EDT 2005 | davef
Q1) Simple way to measure the PCB warpage A1) IPC-TM-650; Method 2.4.22 Bow & Twist Q2) What is the maximum warpage can the SMT machine allow the to accept and place the component without problem. A2) That depends. IPC-A-610 Acceptability of Elect
Electronics Forum | Wed Oct 29 06:17:45 EDT 2014 | julianf
As stated in the title I would like to know the thermo-elastic material properties, most preferably the E-modulus and CTE in x- and y-direction, for Epoxy/E-glass laminates and/or prepregs for various fibreglass cloth styles. Datasheets only give ro
Electronics Forum | Wed Sep 25 15:36:07 EDT 2002 | Jacob Lacourse
Hello all, our company is having issues with boards that are coming in warped. According to IPC-TM-650 it is said that one should use a flat plate when determining acceptability of warpage. What I would like to know is: 1) What should we be using
Electronics Forum | Wed Jan 16 15:22:29 EST 2002 | Terry Burnette
In his book titled "Manufacturing Techniques for Surface Mount Assemblies" author R.J. Klein Wassink describes the relationship between solder land dimensions, component lead coplanarity, board warpage, solder volumes, and solder paste flux wetting b
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