Electronics Forum | Fri Mar 06 12:38:34 EST 2009 | mgershenson
Is this a manual measurement machine? As already stated, knowing the height of the pad underneath the paste brick is critical to knowing the true height an/or volume of paste. Any decent automated inspection system will have a way to factor out the p
Electronics Forum | Sun Apr 19 13:52:45 EDT 1998 | D.Lange
| We have to mount our SMD devices 0.1 to 0.4 mm off the pcb | PCb substrate to compensate for thermal stressing in a | Space enviroment. Has any one any ideas or contacts for | dissolvable pads. this only applies to leadless components Robert, PPI
Electronics Forum | Sun Apr 19 13:50:41 EDT 1998 | D.Lange
| We have to mount our SMD devices 0.1 to 0.4 mm off the pcb | PCb substrate to compensate for thermal stressing in a | Space enviroment. Has any one any ideas or contacts for | dissolvable pads. this only applies to leadless components Robert, PPI
Electronics Forum | Sat Apr 25 19:40:01 EDT 1998 | Stan Traxler
| We have to mount our SMD devices 0.1 to 0.4 mm off the pcb | PCb substrate to compensate for thermal stressing in a | Space enviroment. Has any one any ideas or contacts for | dissolvable pads. this only applies to leadless components We have appl
Electronics Forum | Tue Apr 28 14:50:43 EDT 1998 | Chrys
| | We have to mount our SMD devices 0.1 to 0.4 mm off the pcb | | PCb substrate to compensate for thermal stressing in a | | Space enviroment. Has any one any ideas or contacts for | | dissolvable pads. this only applies to leadless components | Ro
Electronics Forum | Thu Sep 26 23:14:25 EDT 2013 | zsoden
We picked up this old (circa late 80s) Seho 1135 machine last year for next to nothing. It needed a bit of TLC to bring it back to working order but it's 99% working now. The only problem left is that we cannot get sufficient height from the delta wa
Electronics Forum | Tue Dec 04 06:16:50 EST 2001 | Andy
For conventional QFP device, what is the optimun height between lead and pad? 50 microns or 100 microns? What is the factor affecting this height?
Electronics Forum | Thu Oct 24 13:32:03 EDT 2002 | russ
There are many factors that will affect post soldering height. Lead shape/type, pad geometry, fillet formation, etc... You will need to measure each type of component before and after reflow. Russ
Electronics Forum | Tue Dec 04 09:48:43 EST 2001 | davef
Defining the thickness of solder between the lead and the pad, J-001 states "Properly wetted fillet shall be evident." J-001 is available from http://www.ipc.org. Factors that affect this are: * Amount and composition of solder * Amount and compo
Electronics Forum | Mon Dec 17 12:06:58 EST 2007 | pjc
5 Steps to Eliminate Bridges: 1. Establish (wave) Parallelism First and foremost, you must establish board-to-wave parallelism. This is the prerequisite to any wave solder process control. For an understanding of the power of this approach go to ht
