Electronics Forum | Fri Dec 29 16:38:15 EST 2017 | mekmat544
Hello all, I would like to ask you about difference between wettable and nonwettable solder nozzle: Are there some pros and cons for each type? Thank you. Mekmat
Electronics Forum | Wed Oct 15 17:59:08 EDT 2003 | Gabriele
Wettability also will increase, so it could generate briges on fine pitch leaded component. Gabe
Electronics Forum | Mon Jan 09 06:59:04 EST 2006 | slaine
apply flux then dip the component into a solder pot. this would check the wettability of the component.
Electronics Forum | Tue Aug 24 13:45:17 EDT 2004 | Indy
Hi, I am trying to assemble a LTCC component with Pd/Ag surface finish on to Sn/Pb/Ag solder and Sn/Ag/Cu solder. I am passing it through a reflow. I have observed poor wettability at the solder-pad joint. Does anyone have information regarding th
Electronics Forum | Tue Aug 24 13:47:14 EDT 2004 | Indy
Hi, I am trying to assemble a LTCC component with Pd/Ag surface finish on to Sn/Pb/Ag solder and Sn/Ag/Cu solder. I am passing it through a reflow. I have observed poor wettability at the solder-pad joint. Does anyone have information regarding th
Electronics Forum | Tue Aug 24 13:47:16 EDT 2004 | Indy
Hi, I am trying to assemble a LTCC component with Pd/Ag surface finish on to Sn/Pb/Ag solder and Sn/Ag/Cu solder. I am passing it through a reflow. I have observed poor wettability at the solder-pad joint. Does anyone have information regarding th
Electronics Forum | Wed Jul 19 12:54:04 EDT 2023 | calebcsmt
Since side fillets are not a requirement for QFNs/BTCs due to some packages not having wettable side terminations, how does one determine if the side terminations are actually solderable/designed for wetting? Is it simply if the side terminations
Electronics Forum | Tue Jul 30 21:50:28 EDT 2024 | bsziszi
In case of DFN and QFN package the most of the connection is made on the bottom side of the terminal. According to the IPC is not mandatory to have the tip (side flank) to be wetted. Since it is difficult to visually inspect the solder joint, Xray is
Electronics Forum | Thu Oct 26 07:24:01 EDT 2000 | gdandrea
PLEASE COULD YOU TELL ME IF THERE IS A WAY TO AVALUATE CORE FLUXED WIRES IN TERMS OF WETTABILITY/SOLDERABILITY (SOMETHING LIKE MENISCOGRAPH TEST) .I NEED A LAB TEST ALSO ONLY TO COMPARE DIFFERENT WIRES.... REALLY THANK YOU
Electronics Forum | Thu Oct 03 10:02:08 EDT 2002 | davef
Your problem is likely not the Pd-Ag surface layers, but the underlying metal to which you need to wet. Either a base metal is: * Contaminated and poorly wettable. OR * A material [eg, Alloy 42 (check with magnet), Kovar, etc] that is inherently dif
