Electronics Forum | Thu Jan 12 10:05:13 EST 2006 | davef
There's a lots comparisons like this on the web. Here's one: Westwood Associates said on 8/12/2003: ||HASL||OSP||ENIG||Pd||Tin||Silver Flat||no||yes||yes||yes||yes||yes Solderjoint||Cu-Sn||Cu-Sn||Ni-Sn||Ni-Sn||Cu-Sn||Cu-Sn Contact||E-test, ICT||no|
Electronics Forum | Mon Dec 13 14:41:41 EST 2004 | DasonC
Check IPC-7095, 7.4.1.6 For Class 2, 45% of the diameter adn 20.25% for the area.
Electronics Forum | Tue Mar 12 16:01:32 EDT 2024 | SMTA-64387182
What is the best IPC standard to refer to for Cleaning of Printed Board Assemblies? Thanks, Joe
Electronics Forum | Wed Mar 13 13:08:31 EDT 2024 | lambert
Section 8 in the J-STD-001 was the initial place to start with cleaning and the requirements, however with all the changes going on within the industry with increase product densities and such, a revision is being created to help understand the need
Electronics Forum | Wed Mar 27 16:32:22 EDT 2024 | SMTA-64387182
Thanks all, That is very helpful. Joe
Electronics Forum | Thu Mar 14 15:55:34 EDT 2024 | davef
Process Requirement Standard - J-STD-001 - Requirements for soldered electrical and electronic assemblies depicting minimum end product acceptable characteristics as well as methods for evaluation (test methods), frequency of testing and applicable a
Electronics Forum | Mon Apr 17 19:46:39 EDT 2000 | Dave F
Murad: Your customer is smart to be concerned about the affect of changing production processes on product reliability. Your Company is smart to inform customers and keep them in the loop about these changes. In developing your demonstration of th
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