Electronics Forum | Mon Jul 12 12:28:10 EDT 1999 | Wolfgang Busko
| I need some advice concerning reflow of a BGA-292. Since I am not ready to change my entire process to no-clean, I decided to place the lone BGA-292 on a proto run using our BGA re-work station. The pcb is a moderately dense, single-sided, 8-laye
Electronics Forum | Mon May 10 16:37:01 EDT 2004 | davef
First some definitions, the two main types for solder masking near BGA pads are: 1 Pad, Non-Solder Mask Defined. In circuit board design, pads with spacing that does not allow solder (usually bumps) on the pads to contact the adjacent solder mask. [
Electronics Forum | Fri Aug 07 03:16:33 EDT 2020 | rsatmech
It's a BGA component. Missing ball is not possible because we have enabled the vision in pick and place. Solder paste is OM353 type 5 Possibilities of Flux dry before reflow seems valid but I saw the board data it was completed on time like other
Electronics Forum | Fri Aug 07 13:30:22 EDT 2020 | emeto
ASM machines have great algorithms for BGA and I am positive it will detect missing ball. Still, on your pictures it seems like you are severely starving solder in the locations shown on X-ray. Part seem too small to bend that much in reflow to form
Electronics Forum | Tue Aug 04 14:29:14 EDT 2020 | dwl
Is the component an LGA or BGA? If its a BGA, it appears like the component is missing balls, if its an LGA, it appears like the solder isn't wetting to the component. What solder are you using? The wetting to the larger pads in the last pic seems
Electronics Forum | Wed Aug 27 00:20:38 EDT 2008 | rameshr
Dear davef, Will u pls advice what are all the possible defects caused while soldering ( assembling ) this type of boards.
Electronics Forum | Tue May 20 09:34:28 EDT 2008 | roc2x
Well something is different isn't it? * Paste * > Part supplier * Board fabrication * Was the > profile that you reference the measured > temperature or the the settings keyed into the > oven? > > The cross sections seem to show less > than exp
Electronics Forum | Wed Dec 08 10:10:41 EST 1999 | John Thorup
Hi Dave I think you just provided the key to understanding the problem. By your description you are talking about a CBGA (ceramic). These typically have balls composed of 10/90 Sn/Pb which melts at a higher temperature than the 62/36/2 Sn/Pb/Ag (or
Electronics Forum | Fri Apr 30 15:24:12 EDT 1999 | Kevin Hussey
| Ok folk's has anyone used Alpha Metal's UP78 solder paste ? | | Our place is looking to move to that as the way to go, getting rid of the Hereaus 362's and Alpha 737's of the current set up. | | My question's are really : | how is the printabilit
Electronics Forum | Wed May 05 10:57:25 EDT 1999 | Kevin Hussey
| | | Ok folk's has anyone used Alpha Metal's UP78 solder paste ? | | | | | | Our place is looking to move to that as the way to go, getting rid of the Hereaus 362's and Alpha 737's of the current set up. | | | | | | My question's are really : | |
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