Electronics Forum | Wed Nov 23 15:02:38 EST 2005 | tglenn
We are using AIM WS300 solder paste and are experiencing excessive voiding on our BGAs. We have exhausted reflow profile alternatives and just can't beat the voids. Has anyone had success with this paste on BGAs? If so how?
Electronics Forum | Sun Mar 31 22:50:28 EST 2002 | ianchan
Nope, we do not have solder beads, like we said, what we have are near perfect solder fillets except for the portion where the component is "floating OFF" the pcb pads. We are now mucking through the IPC-A-610C for specifications dictation on "tilted
Electronics Forum | Wed May 22 08:20:59 EDT 2002 | xzinxzin
*yes, I used water soluble solder paste (OMG-WS-300), the flux type is ORM0. The component terminations are bare copper,and they�re supposed to be that way. The supplier of these parts is MAXIM, produced from Philipine, get from customer. * We can no
Electronics Forum | Fri Feb 16 11:37:58 EST 2007 | hectorsmtnet
I have been using the Loctite Multicore WS200 with great results for the last two years. We also use the lead free version WS300. I like the flux chemistry (which is the same for both products); it really withstands long soaking times and with very g
Electronics Forum | Sun Apr 05 18:36:41 EDT 1998 | Graham Naisbitt
Sylvia, I believe you will find that contrary to Scott Cooks submission, that the work carried out by Robert Clark of Hughes Missile Systems at (then) Tuscon Arizona formed the basis of the MIL-F-14256 spec which "Qualified?" or at least "Approved" O
Electronics Forum | Thu Apr 04 05:33:19 EST 2002 | ianchan
Hi, hope this helps : 1) BCC (bump chip carrier) production for us, was with a 5mils Stencil. The outer perimeter smallish pads are not much of a problems. For the central large pad, we split the paste print (corresponds to the Stencil apperture op
Electronics Forum | Wed Apr 08 13:46:22 EDT 1998 | Scott Cook
| Sylvia, | I believe you will find that contrary to Scott Cooks submission, that the work carried out by Robert Clark of Hughes Missile Systems at (then) Tuscon Arizona formed the basis of the MIL-F-14256 spec which "Qualified?" or at least "Approve
Electronics Forum | Wed Apr 08 18:15:18 EDT 1998 | Graham Naisbitt
Scott, I am not really in a position to answer this as fully as I would like because most military work with which I am familiar is subject to some degree of secrecy most especially on the internet. At least we have signed up to such restrictions. Ho
| 1 |
