Electronics Forum | Fri Mar 19 10:06:22 EDT 2010 | karlo
Rework is typically done by heating the BGA to 170-180C to first scrape off the fillet. Then, heat to above reflow, and lift the BGA. Then, collapse the solder with heat and flux. Then, back down at 170-180C, scrape off the underfill from the boar
Electronics Forum | Wed Oct 09 08:44:05 EDT 2002 | apg
Dear colleagues. I ask you to prompt me about necessity of drawing pastes through a stensil at the soldering micro BGA with step between leeds 1 mm and 0,8 mm or uses only a flux for this purpose. And what most suitable paste for the soldering of su
Electronics Forum | Mon Jan 21 11:12:20 EST 2008 | davef
Just what is delaminationg during testing? Water washing should be sufficient to clean WS609. On the other hand, it's possible you're conveyor speed is too high to do a good job cleaning the high density areas. What kind of testing have you done to
Electronics Forum | Tue Jun 02 22:19:17 EDT 2009 | mikehe
We have been doing BGA's for years now, and I would suggest updating your profile and place a thermal couple on the BGA, keep in mind the bigger the part the more heat it will need, We stencil print all of BGA's from simple bga's to complex ones, you
Electronics Forum | Mon Jun 01 21:40:18 EDT 2009 | kircchoffs
i need some inputs regarding this process. is this really eliminates voids and other solderability issues on BGA's?
Electronics Forum | Mon Jun 15 15:33:51 EDT 2009 | hegemon
IMHO I would suggest that if you are using flux only during a BGA placement on a small run, that you first tin the pads with your soldering iron, then level the pads back out with wick. Accomplishes two things; adds a little metal to the joint to ma
Electronics Forum | Tue Jun 16 14:46:25 EDT 2009 | grantp
Hi, If your using NXT to place these BGA's then you must be doing large runs. BGA's are the most easy part to place, and don't worry about them. Just stencil paste down for them as any other component. But we use 1:1 reduction on our stencil, so we
Electronics Forum | Thu Jun 04 19:53:44 EDT 2009 | davef
For low volume work and repair, just use a brush dipped in tacky flux to apply flux to the ball array.
Electronics Forum | Tue Jun 02 21:13:08 EDT 2009 | kircchoffs
thanks for the inputs. we are planning to run on fuji nxt i think cycle time will not be an issue. i still have another question if we can still use the same reflow profile for paste? or do we need to create another profile?
Electronics Forum | Sun Aug 07 01:49:58 EDT 2011 | xboxhaxorz
http://intelpr.feedroom.com/?fr_story=236a12fb4342ce6a578b40e8b7121d14c0bab751 Watching this video, i was wondering which type of flux they use for cleaning and for reattachment. I was unable to find the flux they use. Shown at 4:17 4:29 8:59 If un
