Electronics Forum: x-100 (Page 1 of 2)

about Yamaha YS12F component dimension

Electronics Forum | Thu Feb 20 15:38:21 EST 2020 | compit

45 x 100 mm

Bow and twist of PCB's

Electronics Forum | Mon Apr 23 11:44:55 EDT 2001 | CAL

650 Standards are also located in the back of IPC JSTD-001. I am currently looking at 4 pages on bow and twist. Percent bow = R1-R2/L x 100 (R1= Highest point; R2=lowest or resting point; l= length) Percent twist=(R1-R2)/(2xL)x 100 Sorry if this is

Panasert feeder parts

Electronics Forum | Mon Mar 12 18:24:34 EST 2001 | reconsales

Please email or call at 704.795.6610 X 100 (USA) We have thousands of parts and feeders for Panasert machines instock. Also , we can provide repair and calibration services with PFA factory alignment jig.

Underfill Process

Electronics Forum | Wed Jan 22 09:59:28 EST 2003 | Juan C. Ruiz

I would like to know how to decide what to use: a batch oven or a conventional reflow oven to cure an underfill material that require 20 min@150 C. the size of the board is 50 X 100 mm. Cycle time previous to cure is 2 minutes. The lenght of the refl

PLCC Solder fillet NG

Electronics Forum | Tue Mar 08 02:28:03 EST 2011 | nagesh

I have an issue with PLCC Insufficient Heel solder joint fillet.The aperture dimension is : 30 x 100 mils on PCB & on stencil also(1:1 per gerber).Rohs Process. My stencil thickness is 5mils due to presence of Tssop & QFP package & i cannot increase

solder balls

Electronics Forum | Tue May 11 15:52:03 EDT 2004 | Erhan

It's been 10 years since I started to use this editing method but never knew that it was called wendy-house style. :-) This is most probably the answer you're looking for if you're only having problems around the 1206 types. For QFPs, I used to redu

QP-132E // FCM 2

Electronics Forum | Mon Jul 15 16:02:39 EDT 2002 | tmv

Agreed that the FCM has been the choice in the past...but have you seen the 4797S HSP (TCM X100)? Usually (2) 4797S's can replace (1) FCM for about the same purchase price, and only a slighly larger footprint (consider the cost of ownership as well..

Pb Drying / Degassing PWB

Electronics Forum | Mon Nov 24 07:36:15 EST 2008 | davef

No, but we find discussions about relative humidity fairly short sighted, because relative humidity is such an imperfect measure of the amount of moisure in the air. Dew point is much more appealing. R.H. = (amount of moisture)/(maximum amount that

SMT Components

Electronics Forum | Mon Jul 08 08:29:14 EDT 2013 | emeto

You can use any metric ruler to do that. Examples: Pitch 2mm x 200parts = 400mm length or Pitch 4mm x 100parts = 400mm length You can also calculate approximately how many parts you have on the tape by using formula. I don't have the formula but

BGA Solderability Standard

Electronics Forum | Tue Sep 14 17:10:54 EDT 2004 | Jeff, jjg6@agere.com

USE JEDEC Specification EIA/JESD22-B102-C Procedure: 1. Stencil print BGA solder paste pattern onto ceramic substrates 2. Carefully and accurately P&P BGA devices onto the dispensed solder paste pattern to avoid smearing the solder paste. 3. R

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