Electronics Forum | Thu Feb 10 08:25:02 EST 2005 | marakas
Could anyone advise what BGA rework rate we should expect with product that has 4 BGAs (224 pins, 196 pins, 160 pins, 48 pins). Negative factor is that we have old and tired pick & place - Panasonic MPA-G1 or MPA-V without AOI.
Electronics Forum | Fri Mar 20 13:08:57 EST 1998 | Todd Ekeroth
3-20-98 I have a Quad 1V/C (SMT) for sale. It is a lease repossession. Sold for $160k 1/95 Asking Price $49,000.00 o.b.o. Call for further details Todd Ekeroth 1-800-266-1990 ext 125 Regional Capital Leasing
Electronics Forum | Wed Jun 21 16:04:07 EDT 2006 | bman
"Another question, is the facility with 200A @ 208V able to operate this assembly line properly?" That could be a problem, big ovens pull a lot of juice. Our 7 zone Conceptronic HVN-102 runs on 480 Volts and is on a 160 amp breaker, for example. Y
Electronics Forum | Tue May 13 08:59:13 EDT 2014 | gazelle
Hello davef - could it be you are confusing low thermal emf (Seebeck coefficient) with low temperature solder ? I am looking after solder wire and paste with low Seebeck coefficient - cadmium based alloy was OK but banned in europe due to RoHs direct
Electronics Forum | Tue Dec 27 10:11:50 EST 2005 | pjc
Here's a few mfrs. to look at. http://www.vjelectronix.com/vjebeta/index.asp http://www.glenbrooktech.com/advantage.htm http://www.lixi.com/product_workstation.htm http://www.focalspot.com/ http://www.microfocus-x-ray.com/frameset.php?PageN
Electronics Forum | Thu Sep 19 21:46:01 EDT 2002 | scottefiske
In the past year I was responsible for developing and leading a Team focused on AOI, Evaluation, Justification, and with a full ROI required, supporting a HMLV manufacturing environment. If you have in these economic times the additional resources t
Electronics Forum | Tue Aug 23 03:29:37 EDT 2022 | samhe
I received a buck-boost DCDC board with an optical sensor from NextPCB, so I mounted the components and measured the efficiency. Table of contents Board received from NextPCB Solder paste printing Mounting of parts Reflow operation check Attaching
Electronics Forum | Mon Aug 27 15:06:29 EDT 2001 | davef
This otta push Wolfgang over the top ... Recommended reading G.G. Harman, Wire Bonding in Microelectronics : Materials, Processes, Reliability, and Yield, 2nd edition, McGraw-Hill Electronic Packaging and Interconnection Series, 1997. G.G. Harman, R
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