Electronics Forum: zestron test interpretation (Page 1 of 6)

J-STD-001 3.3 Flux interpretation

Electronics Forum | Tue Aug 13 23:22:50 EDT 2024 | simonattwood

3.4 says the solder paste shall meet requirements of 3.3 3.3 says the flux shall be L0 or L1 or if it is not you must have data demonstrating compatibility as per Appendix C. So if you wanted to use ORH0 solder paste, and be J-STD-001 compliant, yo

Cleaning SMD Adhesives

Electronics Forum | Wed Jul 24 01:53:58 EDT 2002 | Mike Konrad

Using ultrasonic technology to remove adhesive is normally not that difficult. I do not know who�s machine you are using (perhaps its ours). In any case, here are some tips for removing adhesives. 1. Heated wash chemistry works better than ambien

Researching stencil cleaners

Electronics Forum | Thu Mar 29 16:35:57 EST 2001 | DMZog

To all following this string, there is at least one other chemistry which has passed the South Coast Air Quality Management District testing and has Clean Air Solvent CERTIFICATION! Call Zestron for details 703-589-1198. Dave

Solvent for stencil cleaning

Electronics Forum | Wed Nov 09 07:22:28 EST 2005 | davef

No. Aqueous Technologies, Kyzen, Petroferm, Zestron, Alpha Metals and many more companies have tested their chemical for use with many different production materials and should be able to discuss the effectiveness of their chemical. Beyond that, ma

pump print stencil

Electronics Forum | Thu Dec 06 02:45:09 EST 2007 | mun4o

hi, we use pump print stencil and have problem with cleaning.we clean the stencil handling, using zestron301, but in the holes stay adhesive.Take a test with ultrasonic cleaner but resalt is not good.

Kyzen or Zestron?

Electronics Forum | Fri Jun 08 12:02:33 EDT 2007 | grics

Thanks for the excellent info on testing uncured solder mask. I just checked with Chris Nash of the Indium Knowledge base and he told me that the Indium 3592 can be cleaned if need be and that I should contact Kyzen or Zestron (they are the 2 compan

Re: BGA fault types

Electronics Forum | Mon Jun 19 13:40:05 EDT 2000 | Dave White

Hi !! Test and Measurement World has pretty good website with graphics to help you interpret BGA fault types...just type in BGA and X-Ray once you arrive at the site. Best Regards, Dave White PDR/XYtronic Rework and X-Ray systems

J-STD-003

Electronics Forum | Fri Feb 15 14:38:59 EST 2013 | bmario

Hi, We are having a problem with the interpretation of the surface evaluation criteria of J-STD-003 section 4.2.2.4.2. "A minimum of 95% of each of the surfaces (i.e. each pad) being tested shall exhibit good wetting. The balance of the surface may

Interpretation for IPC 600H for Clause 3.3.2 (Lifted Land - Cross Sectioned)

Electronics Forum | Mon Apr 28 02:22:52 EDT 2014 | jkhiew

We found repeated pad lifted after different SMT Reflow temperature (eg: 243 deg C and 233 deg C) at an isolated slot. The PCB Supplier had claimed that such condition is acceptable as per IPC 600H Clause 3.3.2 (Cross Sections) - eg: Acceptable - C

Flux residues found after assembly process (Clean process)

Electronics Forum | Fri Jan 08 12:27:55 EST 2016 | aqueous

The most common method is a R.O.S.E tester. They have been around for 30 years and are an industry standard for ionic contamination (flux and other residues) testing. Manufacturers include: Zero Ion www.aqueoustech.com Omegameter / Ionagraph http:/

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