GPD Global | https://www.gpd-global.com/pdf/pbt/PBFT-VS-SPC-User-Guide-20170118-PBT-002P-FORCEWare-v5-6-3.pdf
0.25 kg for 250g strain gauge. Applying excessive weight to this clip, which measures the peel back force of the cover tape, may result in perma- nent damage to the unit
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/pt-BR/divisions/efd/resource-center/thermal-compound-selection-guide
volumétrica: Ohm-cm 1,65x10^14 1,0x10^13 2,0x10^15 2,0x10^15 sobrecorrente sobrecorrente sobrecorrente 2,15x10^15 sobrecorrente 7,28x10^13 Temperatura operacional
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/it-IT/divisions/efd/resource-center/thermal-compound-selection-guide
: V/mil 305 351 265 265 n/d n/d n/d 318 n/d 353 Costante dielettrica: 25° C, 1000Hz 4.5 4.92 5.02 5.02 n/d n/d n/d 5 n/d 4.86 Fattore di dissipazione: 25° C, 1000Hz 0.0029 0.0032 0.0022 0.0022 n/d n/d n/d 0.0027 n/d 0.0019 Resistività del volume: Ohm-cm 1,65x10^14 1,0x10^13 2,0x10^15 2,0x10
GPD Global | https://www.gpd-global.com/co_website/pdf/pump/Jetting-Pump-for-Retrofit-Integration-Chinese.pdf
，控制器到喷射阀(标准配置) 1.5 米 项目 尺寸 A 94.49 毫米 (3.72 寸) B 90.42 毫米 (3.56 寸) C 89.15 毫米 (3.51 寸) D 44.20 毫米 (1.74 寸) E 12.95 毫米 (0.51 寸) 项目 尺寸 F 2X 直径 0.188 寸 通孔 (无须Taper Lock硬件安装) G 38.10 毫米 (1.50 寸) H 34.93 毫米 (1.375 寸) I 12.70 毫米 (0.500 寸) 项目 尺寸 J 25.40 毫米
Baja Bid | https://bajabid.com/wp-content/uploads/2021/05/MY300-SX-Brochure.pdf
– MIDAS Component range Chip (from 01005), SOIC, PLCC, TSOP, QFP, BGA, flip chip, odd- shape, surface-mount connectors, through-hole components, CSP, CCGA, DPAK, Alcap, Tantalum Component specification Min: 0.4 x 0.2 mm (0.016” x 0.008”) (01005) Max: 140 x 73 x 15 mm (5.51” x 2.87” x 0.59”) (1) Max: component weight: 140 g (2) (1) With 4K vision
GPD Global | https://www.gpd-global.com/pdf/pump/Jetting-Pump-for-Retrofit-Integration-Chinese.pdf
，控制器到喷射阀(标准配置) 1.5 米 项目 尺寸 A 94.49 毫米 (3.72 寸) B 90.42 毫米 (3.56 寸) C 89.15 毫米 (3.51 寸) D 44.20 毫米 (1.74 寸) E 12.95 毫米 (0.51 寸) 项目 尺寸 F 2X 直径 0.188 寸 通孔 (无须Taper Lock硬件安装) G 38.10 毫米 (1.50 寸) H 34.93 毫米 (1.375 寸) I 12.70 毫米 (0.500 寸) 项目 尺寸 J 25.40 毫米
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/es-ES/divisions/efd/resource-center/thermal-compound-selection-guide
volumétrica: Ohm-cm 1,65x10^14 1,0x10^13 2,0x10^15 2,0x10^15 sobrecorriente sobrecorriente sobrecorriente 2,15x10^15 sobrecorriente 7,28x10
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/thermal-compound-selection-guide
: Ohm-cm 1.65x10^14 1.0x10^13 2.0x10^15 2.0x10^15 over current over current over current 2.15x10^15 over current 7.28x10^13 Operating Temperature
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/fr-FR/divisions/efd/resource-center/thermal-compound-selection-guide
diélectrique : 25 °C, 1 000 Hz 4.5 4.92 5.02 5.02 n/a n/a n/a 5 n/a 4.86 Facteur de dissipation : 25 °C, 1 000 Hz 0.0029 0.0032 0.0022 0.0022 n/a n/a n/a 0.0027 n/a 0.0019 Résistivité volumique : Ohm-cm 1,65x10^14 1,0x10^13 2,0x10^15 2,0x10^15 surintensité surintensité surintensité 2,15x10^15 surintensité 7,28x10^13 Température de fonctionnement
KingFei SMT Tech | https://www.smtspare-parts.com/sale-9441243-automatic-solder-paste-mixer-smt-assembly-equipment-tin-cream-mixer-for-pcb-assembly.html
(all kinds of 500 g solder paste), ink, epoxy resin, etc; and can also simultaneously mix two tins, which makes the mix more effective. 3. Full automatic, stable performance, easy operation, high safety coefficient
