Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-selection-guide
. The following are a few examples of flux characteristics that modify how a solder paste performs. Restricted Residue NC 26D04 flux residue remains either on or very close to the fillet after reflow
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-selection-guide
. The following are a few examples of flux characteristics that modify how a solder paste performs. Restricted Residue NC 26D04 flux residue remains either on or very close to the fillet after reflow. This feature is most important with NC formulations
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
process. Reflow profiles are most commonly associated with printed circuit boards heated in reflow ovens. Residue The portion of flux that remains after solder paste has been reflowed. Rosin Activated (RA) Consists of rosin, solvent, and aggressive
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-dictionary-of-terms
. Reflow profiles are most commonly associated with printed circuit boards heated in reflow ovens. Residue The portion of flux that remains after solder paste has been reflowed. Rosin Activated (RA) Consists of rosin, solvent, and aggressive activators
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conveyor structure. Specifications: On-line Selective Wave Soldering Machine Model I.C.T SS540 I.C.T SS550 Flux Storage Tank 1 L 3 L Max PCB Size 500*400mm 500*500mm PCB Top Clearance 100mm PCB Weight <8Kg <10Kg N2 Purity of N2: 99.998%, 0.3～0.4 MPa,25 L/min
