PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic3127&OB=ASC.html
(component MPN is ICM-20948) which has 0.4mm pitch and I'm not sure how to design the solder mask for this footprint. I saw some examples online where for QFNs of 400um pitch it was advised to use solder mask
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_rounded-rectangle-pads_topic645.xml
% of the pad width has been tested for the finest 0.4mm pitch component for SOP/QFP. The minimum pad to pad spacing is 0.15 mm (6 mils). Therefore the minimum pad width
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/rounded-rectangle-pads_topic645_post2216.html
% of the pad width has been tested for the finest 0.4mm pitch component for SOP/QFP. The minimum pad to pad spacing is 0.15 mm (6 mils). Therefore the minimum pad width
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic645&OB=ASC.html
% of the pad width has been tested for the finest 0.4mm pitch component for SOP/QFP. The minimum pad to pad spacing is 0.15 mm (6 mils). Therefore the minimum pad width
| https://www.feedersupplier.com/sale-12961129-samsung-sm471-plus-smt-pick-and-place-machine.html
) Component Range: Chip 0402( 01005)- 14mm (12mm), IC, connector (Lead Pitch 0.4mm), BGA, CSP (Pitch 0.4mm). Board Dimension (mm): Minimum order: 50(L) x 40(W), Maximum: Single tool: 510(L) x 460(W), dual tool: 460(L) x250(W). PCB Thickness: 0.38 - 4.2mm Feeder Capacity: (Based On 8mm)120ea /(Docking Cart) 112ea. Utility-Power: AC200/ 208 / 220 / 240 / 380 / 415V
| http://www.feedersupplier.com/sale-12961129-samsung-sm471-plus-smt-pick-and-place-machine.html
) Component Range: Chip 0402( 01005)- 14mm (12mm), IC, connector (Lead Pitch 0.4mm), BGA, CSP (Pitch 0.4mm). Board Dimension (mm): Minimum order: 50(L) x 40(W), Maximum: Single tool: 510(L) x 460(W), dual tool: 460(L) x250(W). PCB Thickness: 0.38 - 4.2mm Feeder Capacity: (Based On 8mm)120ea /(Docking Cart) 112ea. Utility-Power: AC200/ 208 / 220 / 240 / 380 / 415V
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_bga-pad-oversize_topic1913.xml
V2016.02There is an oversize in the setting that's coming up. Is there a reason for it ? If you create a reference BGA with a Pitch of 0.65 and a nominal ball size of
| https://www.feedersupplier.com/quality-13118524-samsung-cp45f-smt-pick-and-place-machine
0.75sec / QFP64 Fixed camera 1.6sec / QFP256 Mounting accuracy 0603 (0201) Chip ± 0.08mm 1005Chip ~ ± 0.1mm QFP ± 0.04mm Component Dimensions Flight Camera 1005 (0402) ~ 22mm IC, 0603 (0201) ~ 12mm (Option) Standard ~ □ Fixed Camera (FOV35) ~ 32mm IC (Lead Pitch: 0.4mm
| http://www.feedersupplier.com/quality-13118524-samsung-cp45f-smt-pick-and-place-machine
0.75sec / QFP64 Fixed camera 1.6sec / QFP256 Mounting accuracy 0603 (0201) Chip ± 0.08mm 1005Chip ~ ± 0.1mm QFP ± 0.04mm Component Dimensions Flight Camera 1005 (0402) ~ 22mm IC, 0603 (0201) ~ 12mm (Option) Standard ~ □ Fixed Camera (FOV35) ~ 32mm IC (Lead Pitch: 0.4mm
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/bga-pad-oversize_topic1913.html
? I tried a 0.50 mm pitch BGA with a ball size of 0.30 mm and the pad oversize was at 0 mm and as soon as I put the ball at 0.50 mm the pad oversize became 0.05 mm
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