Partner Websites: 0.5 (Page 18 of 111)

Footprint For Solderable Jumper? - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/topic2089&OB=DESC.html

: JUMP0510WP = Jumper 0.5 X 1.0 With Paste JUMP0510WOP = Jumper 0.5 X 1.0 With Out Paste  You get the idea.  Stay connected - follow us! Twitter - LinkedIn MSM_KOPF Members Profile Send Private Message Find Members Posts Add to Buddy List Advanced User Joined: 02 Feb 2015 Status: Offline Points

PCB Libraries, Inc.

Footprint For Solderable Jumper? - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2089&OB=ASC.html

? In my current footprint there are 2 pads each 0.5 x 1.0mm with a gap of 0.2mm between the 2 long sides. (02.mm Gap due to clearance requirements

PCB Libraries, Inc.

Thermal Compound Selection Guide | Nordson EFD

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/thermal-compound-selection-guide

.     SPECIFICATIONS Formula 52022 52050 52054 52055 52160 53053 53054 Specific Gravity at 25° C 2.7 2.6 3.0 2.8 2.6 2.8 3.0 Bleed: 24 Hrs., % Weight 0.1 0.01 0.01 0.01 0.3 0.5 0.01 Evaporation: 150C, 24 Hrs., % Weight 0.15 0.6 <2.0 1.0 0.5 0.5 <2.0 Thermal Conductivity

ASYMTEK Products | Nordson Electronics Solutions

열 화합물 선택 가이드 | 노드슨 EFD

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/ko-kr/divisions/efd/resources/thermal-compound-selection-guide

비중 25° C 에서 2.7 2.6 3.0 2.8 2.6 2.8 3.0 블리드 24시간, %/무게 0.1 0.01 0.01 0.01 0.3 0.5 0.01 증발 24시간, %/무게 0.15 0.6 <2.0 1.0 0.5 0.5 <2.0 열 전도도: W/m-K 0.92 3.8 1.3 1.3 2 3.5 1.6 절연 내력: V/mil 305 351 265 265 n/a 318 265

ASYMTEK Products | Nordson Electronics Solutions

Metcal-5000 Archives - Lewis and Clark

Lewis & Clark | http://www.lewis-clark.com/product-tag/metcal-5000/

: • Max PCB Dimensions 250mm x 230mm • PCB Thickness 0.5 – 2.0mm • Component types BGA, CPS, LGA, Micro SMD, MLF, Bumped chip • Airflow 8-24 LPM • Pre-heater base • Heater element 350W top

Lewis & Clark

OK International/ Metcal APR-5000 Array Package Rework Station - Lewis and Clark

Lewis & Clark | https://www.lewis-clark.com/product/ok-international-metcal-apr-5000-array-package-rework-sttion/

: • Max PCB Dimensions 250mm x 230mm • PCB Thickness 0.5 – 2.0mm • Component types BGA, CPS, LGA, Micro SMD, MLF, Bumped chip • Airflow 8-24 LPM • Pre-heater base • Heater element 350W top

Lewis & Clark

Auswahlhilfe für Wärmeleitpasten | Nordson EFD

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/de-de/divisions/efd/resources/thermal-compound-selection-guide

0.01 0.01 0.3 0.5 0.01 Verdunstung: 150°C, 24 Std., % Gewicht 0.15 0.6 <2.0 1.0 0.5 0.5 <2.0 Wärmeleitfähigkeit: W/mK 0.92 3.8 1.3 1.3 2 3.5 1.6 Durchschlagsfestigkeit

ASYMTEK Products | Nordson Electronics Solutions

96273

Heller 公司 | https://hellerindustries.com.cn/part/96273/

96273 » Parts » 96273 96273 : M6-0.5 X 12MM BHCS Part Name: M6-0.5 X 12MM BHCS Part #:96273 Contact Us About: M6-0.5 X 12MM BHCS, 96273 Machine Tooth Sprocket E-Mail Us: Fields with * are required

Heller 公司

96581M

Heller 公司 | https://hellerindustries.com.cn/part/96581m/

96581M » Parts » 96581M 96581M : M3-0.5 X 8mm SSS-CP Part Name: M3-0.5 X 8mm SSS-CP Part #:96581M Contact Us About: M3-0.5 X 8mm SSS-CP, 96581M Machine Tooth Sprocket E-Mail Us: Fields with * are required

Heller 公司


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