ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/products/selective-soldering-systems/novo-460
. Use of a single drop-jet fluxer and solder pot allows soldering of printed circuit boards as large as 460 x 460 mm (18.1 x 18.1 in.). Novo ® 460S flux, preheat and soldering configuration When configured with dual drop-jet fluxers and dual solder pots, the Novo
Lewis & Clark | http://www.lewis-clark.com/product-tag/assembleon-opal/
• 01 fix tray removable • 2 cameras • Hours 5,761 • Maximum board size (L x W – (18.1″ x 17.3″) • Minimum board size (L x W) -(2″ x 2″) • Board thickness – 0.4 to 4.0mm (0.016″ x 0.16″) Condition: Complete & Operational Location
Lewis & Clark | http://www.lewis-clark.com/product-tag/opal-x2/
• 01 fix tray removable • 2 cameras • Hours 5,761 • Maximum board size (L x W – (18.1″ x 17.3″) • Minimum board size (L x W) -(2″ x 2″) • Board thickness – 0.4 to 4.0mm (0.016″ x 0.16″) Condition: Complete & Operational Location
Lewis & Clark | http://www.lewis-clark.com/product-tag/opal-xii/
• 01 fix tray removable • 2 cameras • Hours 5,761 • Maximum board size (L x W – (18.1″ x 17.3″) • Minimum board size (L x W) -(2″ x 2″) • Board thickness – 0.4 to 4.0mm (0.016″ x 0.16″) Condition: Complete & Operational Location
Lewis & Clark | http://www.lewis-clark.com/product-tag/fes-cart/
. component height 21.5mm) • Maximum board size (L x W – (18.1″ x 17.3″) • Minimum board size (L x W) -(2″ x 2″) • Board thickness – 0.4 to 4.0mm (0.016″ x 0.16″) Condition: Complete & Operational Location
Lewis & Clark | http://www.lewis-clark.com/product-tag/fes/
. component height 21.5mm) • Maximum board size (L x W – (18.1″ x 17.3″) • Minimum board size (L x W) -(2″ x 2″) • Board thickness – 0.4 to 4.0mm (0.016″ x 0.16″) Condition: Complete & Operational Location
Lewis & Clark | http://www.lewis-clark.com/product-tag/fnc-nozzles/
. component height 21.5mm) • Maximum board size (L x W – (18.1″ x 17.3″) • Minimum board size (L x W) -(2″ x 2″) • Board thickness – 0.4 to 4.0mm (0.016″ x 0.16″) Condition: Complete & Operational Location
Lewis & Clark | http://www.lewis-clark.com/product-tag/assembleon-mg-8/
. component height 21.5mm) • Maximum board size (L x W – (18.1″ x 17.3″) • Minimum board size (L x W) -(2″ x 2″) • Board thickness – 0.4 to 4.0mm (0.016″ x 0.16″) Condition: Complete & Operational Location
Lewis & Clark | https://www.lewis-clark.com/product/assembleon-opal-xii-pick-place/
• 2 cameras • Hours 5,761 • Maximum board size (L x W – (18.1″ x 17.3″) • Minimum board size (L x W) -(2″ x 2″) • Board thickness – 0.4 to 4.0mm (0.016″ x 0.16″) Condition: Complete & Operational Location
Lewis & Clark | https://www.lewis-clark.com/product/assembleon-mg-8-pick-place/
) • Maximum board size (L x W – (18.1″ x 17.3″) • Minimum board size (L x W) -(2″ x 2″) • Board thickness – 0.4 to 4.0mm (0.016″ x 0.16″) Condition: Complete & Operational Location
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