670 1a33 and tin results

•  Joint quality is dependent on solderability •  The basic principle of soldering is for the solder to bond to the base material. •  Substrate must be fully and rapidly wetted by the tin in the solder being applied

| https://www.eptac.com/wp-content/uploads/2012/10/eptac_11_14_12.pdf

SolderTips: Dealing with the Problems of Soldering Iron Tips Breaking Down | EPTAC

| https://www.eptac.com/soldertips/dealing-with-the-problems-of-soldering-iron-tips-breaking-down/

quite higher than the melting temperature of the good old 63/37 or 60/40 tin/lead alloy solder. We were wrong. Increasing the solder iron temperature did not help, in fact, it created more problems and tip usage went through the roof

problems of embrittlement. 11 Gold Embrittlement • Eutectic tin-lead microstructure with gold embrittlement [BSE SEM image at 3400X]. Bright areas are Pb-phase, darker areas are Sn-phase, and intermediate contrast areas are Au-Sn IMC

| https://www.eptac.com/wp-content/uploads/2012/09/eptac_10_17_12.pdf

Dismantling skill of SMT processing - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/dismantling-skill-of-smt-processing_topic2356_post9693.html

.       For components with few pins, such as resistance, capacitance, diode, triode etc., tin on one of the pads on the PCB board, then use the tweezer to hold the component to the mounting position and hold it against the board

PCB Libraries, Inc.

Dismantling skill of SMT processing - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/dismantling-skill-of-smt-processing_topic2356.html

.       For components with few pins, such as resistance, capacitance, diode, triode etc., tin on one of the pads on the PCB board, then use the tweezer to hold the component to the mounting position and hold it against the board

PCB Libraries, Inc.

Dismantling skill of SMT processing - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2356&OB=ASC.html

.       For components with few pins, such as resistance, capacitance, diode, triode etc., tin on one of the pads on the PCB board, then use the tweezer to hold the component to the mounting position and hold it against the board

PCB Libraries, Inc.

Industrial & Machinery | Nordson DAGE

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/industries/industrial-and-machinery?con=t&page=3

Industrial & Machinery | Nordson DAGE X-Ray Inspection and Test Products Corporate | Global Directory | Languages Division Only All of Nordson Home Products Bondtesting Systems Micro Materials Testing Wafer Inspection and Metrology X-ray Inspection Systems X-ray Counting Systems Applications Battery

ASYMTEK Products | Nordson Electronics Solutions

#1 Evaluation Parameters  Boards, HASL and OSP  Components, Tin and Tin/Lead  Solder, SAC 305 and Tin/Lead Investigation of the Forward and Backward Compatibility of Solder Alloys With Component Finishes for HASL and OSP PCB Finish, Anand Kannabiran, Elavarasan T

| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_12_17_08.pdf

Intermetallic Growth on PCB-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com/te_news_bulletin/2021-08-31/23575.chtml

:16 Intermetallic Growth on PCB Where the tin-lead solder adheres to the copper of the lead (from plating) and to the pad (from hot air leveling or other pcb solder-coating method

Intermetallic Growth on PCB-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com:9060/te_news_bulletin/2021-08-31/23575.chtml

:20 Intermetallic Growth on PCB Where the tin-lead solder adheres to the copper of the lead (from plating) and to the pad (from hot air leveling or other pcb solder-coating method