| https://www.eptac.com/soldertips/dealing-with-the-problems-of-soldering-iron-tips-breaking-down/
quite higher than the melting temperature of the good old 63/37 or 60/40 tin/lead alloy solder. We were wrong. Increasing the solder iron temperature did not help, in fact, it created more problems and tip usage went through the roof
| https://www.eptac.com/wp-content/uploads/2012/09/eptac_10_17_12.pdf
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/dismantling-skill-of-smt-processing_topic2356_post9693.html
. For components with few pins, such as resistance, capacitance, diode, triode etc., tin on one of the pads on the PCB board, then use the tweezer to hold the component to the mounting position and hold it against the board
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/dismantling-skill-of-smt-processing_topic2356.html
. For components with few pins, such as resistance, capacitance, diode, triode etc., tin on one of the pads on the PCB board, then use the tweezer to hold the component to the mounting position and hold it against the board
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2356&OB=ASC.html
. For components with few pins, such as resistance, capacitance, diode, triode etc., tin on one of the pads on the PCB board, then use the tweezer to hold the component to the mounting position and hold it against the board
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/industries/industrial-and-machinery?con=t&page=3
Industrial & Machinery | Nordson DAGE X-Ray Inspection and Test Products Corporate | Global Directory | Languages Division Only All of Nordson Home Products Bondtesting Systems Micro Materials Testing Wafer Inspection and Metrology X-ray Inspection Systems X-ray Counting Systems Applications Battery
| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_12_17_08.pdf
| http://etasmt.com/te_news_bulletin/2021-08-31/23575.chtml
:16 Intermetallic Growth on PCB Where the tin-lead solder adheres to the copper of the lead (from plating) and to the pad (from hot air leveling or other pcb solder-coating method
| http://etasmt.com:9060/te_news_bulletin/2021-08-31/23575.chtml
:20 Intermetallic Growth on PCB Where the tin-lead solder adheres to the copper of the lead (from plating) and to the pad (from hot air leveling or other pcb solder-coating method