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UNDERFILL VOIDS

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/2271-underfill-voids

- Application Note 2271 Sample & Method Flip chip imaged on C-SAM at 300 MHz frequency. Ultrasound was gated on the chip-to-bump interface, a depth that also includes the cured underfill material

ASYMTEK Products | Nordson Electronics Solutions

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