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. In many cases, X-Ray inspection (2D and 3D) provides the only non-destructive techniques to inspect optically hidden components and solder joints such as BGA, POP, QFN, flip chips, through holes, TSVs, micro-bumps, copper pillars, etc
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508.5 In-line Flux and Preheat Automatic Solder Inspection Technologies Overview - All 1D and 2D Barcode Reader 2Segment Configuration Board Warp Sensing Closed Loop In Process Flux Verification
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ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-selection-guide
. The following are a few examples of flux characteristics that modify how a solder paste performs. Restricted Residue NC 26D04 flux residue remains either on or very close to the fillet after reflow
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/de-DE/divisions/dage/about/blog/the-power-of-2d-and-3d-inspection
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