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KD Electronics Ltd. | http://www.kundasmt.com/a/PRODUCTS/3041.html
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| https://www.eptac.com/faqs/ask-helena-leo/ask/bottom-termination-parts
: I have a bowed part on a bottom terminated part, and I’m trying to find the specification on such a part. Do you know the bow specification of IPC 7093, section
| https://www.eptac.com/faqs/ask-helena-leo/ask/air-bubbles-or-voids-in-solder-joints
. The only documents that discuss this from an IPC perspective are IPC-A-610 in section 8.3.12 Surface Mount Area Array, IPC-7093 – Design and Assembly Process Implementation for Bottom Termination Components and IPC-7095C
| https://www.eptac.com/ask/air-bubbles-or-voids-in-solder-joints/
. The only documents that discuss this from an IPC perspective are IPC-A-610 in section 8.3.12 Surface Mount Area Array, IPC-7093 – Design and Assembly Process Implementation for Bottom Termination Components and IPC-7095C
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/smd-solder-mask-defined-and-nsmd-pads_topic1768.html
PCB land pattern soldered BGA? I have seen a describtion in IPC-7093 6.1.3.6 solder mask design. NSMD is better than SMD on QFN solder joint strenth
