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Dispense on Flip Chip & BGA, Bumped Silicone Die: Underfill Dispensing Home Products Fluid Dispensing Equipment High Precision Dispenser -MAX Series Large Format Board Dispensing -DS Series Table Top Dispensing Equipment Loader
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/blog/112921-automated-adhesive-dispensing-system-simplifies-edge-sealing-on-pcb
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ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/0355-head-sink-and-adhesive
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(IMAPS LED ATW, October 2005) (PDF 267 KB) IMAPS Device Packaging 2019 Nordson ASYMTEK Nordson ASYMTEK presenting on underfill dispensing for chip-on-wafer and high-throughput jetting in micro-device packaging at iMAPS Device Packaging Conference
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COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
2481 Hilton Drive
Gainesville, GA USA
Phone: (770) 538-0411
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