| https://www.eptac.com/faqs/ask-helena-leo/ask/solder-selection-for-printed-circuit-boards-and-terminals
. My question is, would you use that ROL0 solder on the entire solder termination when... Question: I know for tinning stranded wires you should not use Type H or M flux, so we are ordering a No-clean solder Sn63Pb37 with a flux designator ROL0
| https://www.eptac.com/ask/solder-selection-for-printed-circuit-boards-and-terminals/
. My question is, would you use that ROL0 solder on the entire solder termination when you solder it into a cup or terminal, or use a higher level solder such as ROMI
| https://www.eptac.com/wp-content/uploads/2007/10/webinar_eptac_10_17_07.pdf
| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_10_17_07.pdf
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf
is interesting to note that Ag was detected in the fracture area. Figure 11. Fracture Area of SnPb Joint Reflowed at 215C for 90 sec. Figure 12. Fracture Area of SAC305 Joint Reflowed at 250C for 90 sec. A typical termination structure of lead-free
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/pan_APEX06-1.pdf
is interesting to note that Ag was detected in the fracture area. Figure 11. Fracture Area of SnPb Joint Reflowed at 215C for 90 sec. Figure 12. Fracture Area of SAC305 Joint Reflowed at 250C for 90 sec. A typical termination structure of lead-free
| http://etasmt.com/cc?ID=te_news_industry,3561&url=_print
. If slowly cooled, large grains arise, the boundaries of which may serve as precipitation points for Sn, resulting in cracks. Tin-Silver. Sn-3.5%Ag exhibits good solderability and mechanical properties and has the longest history of reliable usage as a lead-free solder
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm
: Yoshinori Ejiri, Hitachi Chemical Co., Ltd. " The Wire Bonding Reliability of Electroless Ni/Pd/Au Plating Influence of Electroless Pd Deposition Reaction " View past award winners 2018 1st Place: Richard Coyle, Ph. D
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
Viktoria Rawinski Abstract 31-2 Understanding the Higher Wire Bond Strength Advantage of Au/Pd/Au (IGEPIG) as Compared to Alternate Immersion Gold Finishes, Before and After Heat Treatment with Different Types of Wires Tatsushi Someya, Tetsuya Sasamura, Ph.D
| http://etasmt.com:9060/te_news_industry/2013-03-29/3561.chtml
. If slowly cooled, large grains arise, the boundaries of which may serve as precipitation points for Sn, resulting in cracks. Tin-Silver. Sn-3.5%Ag exhibits good solderability and mechanical properties and has the longest history of reliable usage as a lead-free solder
