Lewis & Clark | https://www.lewis-clark.com/shop/
) Power: 208V ~ 3 Phase ~ 50/60Hz ~ 15Amps Condition: Complete & Operational Location & Shipping: USA / FOB Origin Availability: Immediate for purchase / 2-4 weeks for shipping Out Of Stock 2008 Agilent Medalist i3070 In-Circuit Tester Out Of Stock 2008 Speedline Aquastorm 200 Inline Wash System Make: Speedline Model
Lewis & Clark | http://www.lewis-clark.com/shop/
: 2006 Details: CE Marked Stencil Cleaner Paste Dispense Hawkeye 750 Camera Left to Right configuration 230V – 50/50Hz- 10Amps Condition: Complete
Lewis & Clark | http://www.lewis-clark.com/shop/page/21/
& Place Machine Vintage: 2006 Software Version: 505.5 Details: 12 Head Nozzle 110/208v – 50/60Hz CE Marked Complete and Operational
Lewis & Clark | https://www.lewis-clark.com/shop/page/8/
– 50/60Hz Electro Design for Mydata EP708 78.5″ Conveyor Make: Electro Design (for Mydata) Model: EP708 Details: 78.5″ Total Conveyor Length Edge Belt
Lewis & Clark | http://www.lewis-clark.com/shop/page/9/
: Electro-Design Quantity: 2 available Model: MB-708 Vintage: 06/2004 Details: 120/240 VAC – 50/60Hz 78.5 Conveyor Length 20” width adjust (automatic) 4 stage SMEMA E-STOP Condition
Lewis & Clark | http://www.lewis-clark.com/product-category/pick-place/page/4/
” Six Laser Flying Vision and Stage Vision systems One Upward Looking Fixed Camera Vision System for IC Placement rates: CHIP 1608 18500 CPH (IPC9850) SOP 15000 CPH (IPC9850) QFP 5500 CPH (IPC950) 220V – 3 Phase – 50/60Hz Condition: Complete
1st Place Machinery Inc. | http://www.firstplacemachinery.com/index.html
, Aqueous Technologies AQ400 , ECD 9600 , Photon Dynamics SV6000 , Orbotech VT9300 , Diagnosys Scanpoint 50 , FUJI 153E-XL , GPD CF10 Radial Lead Former , Cyberoptics SE200 , HP3070 , Asymtek 1020 , CR
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
Solder crack path typically found at solder joint / BGA package interface BGAs with 50% of their solder joints containing voids in the 35-60
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
Solder crack path typically found at solder joint / BGA package interface BGAs with 50% of their solder joints containing voids in the 35-60
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