| https://www.eptac.com/faqs/ask-helena-leo/page/2
? Read More Failing to Remove Gold Plating in Final Assembly QUESTION Question: If the gold plating on the surface of via holes is not removed from the printed circuit boards, does this constitute a defect or failure of the
? Read Answer Failing to Remove Gold Plating in Final Assembly Question: If the gold plating on the surface of via holes is not removed from the printed circuit boards, does this constitute a defect or failure of the
| https://www.eptac.com/faqs/soldertips?hsLang=en
. Is this condition acceptable under any circumstances, or is it always a reject in all three classes? Read More Issues of Burnt Flux on Class 3 PCB Assemblies General Tip Question
| https://www.eptac.com/faqs/soldertips
. Is this condition acceptable under any circumstances, or is it always a reject in all three classes? Read More Issues of Burnt Flux on Class 3 PCB Assemblies General Tip Question
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5255
) when the solder gold content exceeds 5% by weight. Controlling the component gold plating thickness as well as the soldering process temperature and time can prevent gold embrittlement
| https://www.eptac.com/soldertips/defining-shear-forces-for-surface-mounted-components/
. Recent Posts Solder Pot Maintenance and Dross Removal What’s with the expiration dates on solder paste or wire? Accept or Reject: Solder Contacting Component Bodies Issues of Burnt Flux on Class 3 PCB Assemblies Gold Removal Issues with Hollow Cup Connectors Acceptability of Conformal Coating Bubbles Search Looking for Training Products? SolderTraining.com can help
Heller Industries Inc. | https://hellerindustries.com/dull-solder-joints/
. Process and design-related causes of Dull Solder Joints: Impurity in the component plating Impurity in the circuit board finish Bad or expired solder paste Reflow-related causes of dull solder joints
Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote/?cpn=5
* Materials FR4(130Tg) FR4(170Tg) Copper Weight 1 oz 2 oz 3 oz 4 oz Finish Plating HASL (Leaded) LF HASL Immersion Gold Immersion Silver White Tin OSP Minimum Trace/Space 0.005" 0.006" 0.007
| http://etasmt.com:9060/te_news_bulletin/2021-08-31/23576.chtml
. Process and design-related causes: • Impurity in the component plating • Impurity in the circuit board finish • Bad or expired solder paste
Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote/?cpn=2
) Copper Weight 1 oz 2 oz 3 oz 4 oz Finish Plating HASL (Leaded) LF HASL Immersion Gold Immersion Silver White Tin OSP Minimum Trace/Space 0.005" 0.006" 0.007
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