Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys
Lewis & Clark | https://www.lewis-clark.com/product-tag/preowned-bga-rework-station/
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Imagineering, Inc. | https://www.pcbnet.com/blog/identifying-and-correcting-solder-bridge-defects/
– Miniaturization is a crucial element of effective printed circuit board design. Unfortunately, designs that include pads and stencils that are too close to each other can result in solder bridging
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ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/products/solder-paste
EFD’s FluxPlus is perfect for BGA rework, mobile device repair, reflowing solder paste, and more. Liquidyn® P-Jet SolderPlus® Jetting System This complete solder paste jetting system includes the Liquidyn P-Jet SolderPlus jet valve, which is designed specifically to jet Nordson EFD SolderPlus solder paste
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/products/solder-paste-and-soldering-equipment?con=t&page=35
. SEMICON West 2013 Nordson ASYMTEK See Nordson ASYMTEK at the Moscone Center in San Francisco, California, USA - Booth #6071 Dage - Atotech Case Study Nordson DAGE Correlating the Presence of Popcorned BGA Devices Post Reflow with solder-ball diameter measurements from X-ray Inspection Nordson DAGE AOI and X-Ray
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/products/solder-paste?con=t
. Safety Data Sheets Nordson EFD FluxPlus™ Paste Flux Nordson EFD Formulated to work with any alloy and heating process, Nordson EFD’s FluxPlus is perfect for BGA rework, mobile device repair, reflowing solder paste, and more
