Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
. An opposing school of thought was that voids act as crack arrestors, which improve solder joint life. The root cause of voids in BGA solder joints is well understood by the electronics industry with a number of papers published on the topic [1, 2, 3]. R
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/1012-pbga-popcorn-cracks
, Through Transmission - Application Note 1012 Acoustic image of a large popcorn crack located on the bottom left BGA. Sample & Method The same plastic BGA packages shown in Note
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/2602-c-sam-and-q-bam
. The cross-sectional Q-BAM image was made along the horizontal line drawn through the questionable area. The cross-sectional view in the top half of the Q-BAM image shows that the "questionable" feature is actually a crack in the molding compound
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/industries/medical-life-science-and-pharmaceutical?con=t&page=8
: Medical, Life Science and Pharmaceutical Acoustic Impedance Polarity Detector (AIPD)™ Nordson SONOSCAN Hidden Trouble in a BGA Package Nordson SONOSCAN Special Values Nordson SONOSCAN Historic Savings Opportunity
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/sonoscan-applications/microelectronics
below demonstrate how our technology makes it easier to inspect and detect defects. PQFP Optical and acoustic images showing popcorn crack defect. PQFP
| https://www.eptac.com/wp-content/uploads/2012/06/eptac_07_18_12.pdf
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/applications/injection-molding?con=t&page=19
. Products Content Your results for: Injection Molding Equipment C-SAM AND Q-BAM Nordson SONOSCAN Plastic BGA - Q-BAM acoustic cross-section - Application Note 2614 PDIP DELAMINATIONS ON THE BACKSIDE Nordson SONOSCAN PDIP Delaminations
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/imaging-modes
. The large backwards ”J” indicates a popcorn crack in this mold compound. Small circular voids are also noted. Multi-Scan Multi-Scan of this TQFP provides a C-scan view of this device at three levels simultaneously
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes
Popcorn Crack 0299 PBGA Die Face Delaminations 0309 TSOP Die Cracks 0434 PQFPs Production Scanning 0759 TSOP Cracked Die 1009 PBGA Delaminations, Through Transmission 1011 PBGA Delaminations 1012 PBGA
