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PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/RSS_bga-chamfer_topic727.xml
: The BGA, CGA is an exception... Author: Tom HSubject: 727Posted: 03 Dec 2012 at 3:12pmThe BGA, CGA is an exception because the plastic package is lifted off the board surface by the Balls or Columns.
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/bga-chamfer_topic727_post2522.html
: 5188 Post Options Post Reply Quote Tom H Report Post Thanks(0) Quote Reply Posted: 03 Dec 2012 at 3:12pm The BGA, CGA is an exception because the plastic package is lifted off the board surface by the Balls or Columns
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic727&OB=ASC.html
: 5380 Post Options Post Reply Quote Tom H Report Post Thanks(0) Quote Reply Posted: 03 Dec 2012 at 3:12pm The BGA, CGA is an exception because the plastic package is lifted off the board surface by the Balls or Columns
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_bga-pad-oversize_topic1913.xml
. This is when the pad size round-off = 0.010.70 / 0.580.60 / 0.500.50 / 0.450.45 / 0.410.40 / 0.370.35 / 0.330.30 / 0.24Are you sure you're using Library Expert V2016.07? BGA Pad Oversize
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. Home Catalog Blog About us Home › BGA Rework Stations BGA Rework Stations Browse by All BGA Reballing BGA Rework BGA Rework Machine BGA Rework Services BGA Rework Station BGA Rework Stations BGA Rework System Chip Off Chip Off
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BGA Pad Oversize - PCB Libraries Forum Forum Home > PCB Footprint Expert > Questions & Answers New Posts FAQ Search Events Register Login BGA Pad Oversize
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| https://www.eptac.com/soldertips/soldertip-46-open-connections-found-on-bga-components/
. It has been seen, over the years, that BGA components do warp and many times creates shorts in the center of the device itself. Based upon the size of the component, when this happens, the edges of the components are rising up off the surface of the PCB
