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), “Transitioning to Lead-free Assemblies,” Printed Circuit Design and Manufracture, March 2005, pp. 17-23. Newman, K., “BGA Brittle Fracture Alternative Solder Joint Integrity Test Methods,” Proceedings of IEEE/ECTC the 55th Electronic Components and Technology
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/pan_APEX06-1.pdf
), “Transitioning to Lead-free Assemblies,” Printed Circuit Design and Manufracture, March 2005, pp. 17-23. Newman, K., “BGA Brittle Fracture Alternative Solder Joint Integrity Test Methods,” Proceedings of IEEE/ECTC the 55th Electronic Components and Technology
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