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devices with less than 1.0mm pitch which (according to IPC) requires 10% reduction. 14.2.4 Attachment Site Planning The attachment site or land pattern geometry recommended for BGA devices is round with the diameter adjusted to meet contact pitch and size variation
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/bga-pad-size_topic2607_post12477.html
: 05 Jan 2012 Location: San Diego, CA Status: Offline Points: 5193 Post Options Post Reply Quote Tom H Report Post Thanks(1) Quote Reply Topic: BGA Pad Size Posted: 23 Jun 2022 at 7:52am Here is the BGA Pad Size Reduction table for Collapsing Balls
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devices with less than 1.0mm pitch which (according to IPC) requires 10% reduction. 14.2.4 Attachment Site Planning The attachment site or land pattern geometry recommended for BGA devices is round with the diameter adjusted to meet contact pitch and size variation
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/bga-pad-size_topic2607_post10649.html
devices with less than 1.0mm pitch which (according to IPC) requires 10% reduction. 14.2.4 Attachment Site Planning The attachment site or land pattern geometry recommended for BGA devices is round with the diameter adjusted to meet contact pitch and size variation
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