Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
150 m BLT. Fig. 5: CSAM of sTIM Failure Due to Substrate Negative Deflection An upward bow in the substrate will force the sTIM out from the bondline, creating extrusion failures. A properly designed sTIM1 assembly produces an interface with full
| 1 |
winsouce.jpg)
