PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2990&OB=ASC.html
Include Via in Thermal Pad Footprint - PCB Libraries Forum Forum Home > PCB Footprint Expert > Questions & Answers New Posts FAQ Search Events Register Login Include Via in Thermal Pad Footprint
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_via-fanout-for-bga_topic1888.xml
. Many CAD tools have automatic via fanout and if it doesn't, you need to ask the CAD vendor to add that feature into the CAD tool. Vias in a PCB Footprint library part become Pins and the BGA pad and via connecting line become Associated Copper
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/via-fanout-for-bga_topic1888_post7702.html
. Vias in a PCB Footprint library part become Pins and the BGA pad and via connecting line become Associated Copper. This makes the library part size very big
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/via-fanout-for-bga_topic1888.html
. Many CAD tools have automatic via fanout and if it doesn't, you need to ask the CAD vendor to add that feature into the CAD tool. Vias in a PCB Footprint library part become Pins and the BGA pad and via connecting line become Associated Copper
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic1888&OB=ASC.html
. Many CAD tools have automatic via fanout and if it doesn't, you need to ask the CAD vendor to add that feature into the CAD tool. Vias in a PCB Footprint library part become Pins and the BGA pad and via connecting line become Associated Copper
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/bga-pad-size_topic2607_post10645.html
: San Diego, CA Status: Offline Points: 5184 Post Options Post Reply Quote Tom H Report Post Thanks(0) Quote Reply Posted: 22 Mar 2021 at 2:10pm Non-collapsing BGA balls are intended for fine pitch parts where a normal dog-bone via fanout cannot be achieved and you must use via-in-pad technology for this trace routing solution
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/bga-pad-size_topic2607_post12477.html
: 05 Jan 2012 Location: San Diego, CA Status: Offline Points: 5193 Post Options Post Reply Quote Tom H Report Post Thanks(0) Quote Reply Posted: 22 Mar 2021 at 2:10pm Non-collapsing BGA balls are intended for fine pitch parts where a normal dog-bone via fanout cannot be achieved and you must use via-in-pad technology for this trace routing solution
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/bga-pad-size_topic2607_post11390.html
: San Diego, CA Status: Offline Points: 5183 Post Options Post Reply Quote Tom H Report Post Thanks(0) Quote Reply Posted: 22 Mar 2021 at 2:10pm Non-collapsing BGA balls are intended for fine pitch parts where a normal dog-bone via fanout cannot be achieved and you must use via-in-pad technology for this trace routing solution
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/bga-pad-size_topic2607_post10649.html
: San Diego, CA Status: Offline Points: 5484 Post Options Post Reply Quote Tom H Report Post Thanks(0) Quote Reply Posted: 22 Mar 2021 at 2:10pm Non-collapsing BGA balls are intended for fine pitch parts where a normal dog-bone via fanout cannot be achieved and you must use via-in-pad technology for this trace routing solution
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/bga-pad-size_topic3004.html
? I understand that the main reason for the pad oversize is to be able to use via in pad due to the limitation of routing traces in the same layer as the pad
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