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About Us Sonoscan Leadership Company History Locations Patent List News Events Careers Nordson SONOSCAN Home Support Application Notes MULTIPLE VOIDS MULTIPLE VOIDS Flip Chip Underfill Multiple Voids
| https://www.eptac.com/faqs/ask-helena-leo/ask/gold-wire-bond-failing-pull-test
) Conductor lifted from board or substrate. (b-5) Fracture within board or substrate. c. For flip-chip configurations: (c-1) Failure in the bond material or pedestal, if applicable. (c-2) Fracture of die (or carrier) or substrate
Lewis & Clark | http://www.lewis-clark.com/category/uncategorized/
– 30TH Auction Opens June 24, 2020 @ 8:00 AM EST Auction Closing Begins June 30, 2020 @ 1:00 PM EST FEATURED ITEMS 2018 ASM Siplace TX2i High Speed Chip Shooter… Lewis and Clark’s Most Wanted
| https://www.eptac.com/ask/gold-wire-bond-failing-pull-test/
) Conductor lifted from board or substrate. (b-5) Fracture within board or substrate. c. For flip-chip configurations: (c-1) Failure in the bond material or pedestal, if applicable. (c-2) Fracture of die (or carrier) or substrate
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic1002&OB=DESC.html
– Gull Wing leads should now be displaying properly 3D STEP – SOP now has a Mini SOP 3D body variation for small SOP parts 3D STEP – Changed body color of Chip Resistor (Black) and Fuse (Green) FP Designer
Lewis & Clark | https://www.lewis-clark.com/shop/page/11/
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PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_dual-flat-nolead-dfn-2pin-nonsymmetrical_topic915.xml
. The competitor created a three-terminal device, but there are two cathode connections. The cathode connection is broken into two to eliminate huge disparities in solder pod areas that could cause the larger cathode plate to lift chip and break anode pad connection.  
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/dual-flat-nolead-dfn-2pin-nonsymmetrical_topic915_post3927.html
. The competitor created a three-terminal device, but there are two cathode connections. The cathode connection is broken into two to eliminate huge disparities in solder pod areas that could cause the larger cathode plate to lift chip and break anode pad connection
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/dual-flat-nolead-dfn-2pin-nonsymmetrical_topic915.html
. The competitor created a three-terminal device, but there are two cathode connections. The cathode connection is broken into two to eliminate huge disparities in solder pod areas that could cause the larger cathode plate to lift chip and break anode pad connection
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/dual-flat-nolead-dfn-2pin-nonsymmetrical_topic915.html
. The competitor created a three-terminal device, but there are two cathode connections. The cathode connection is broken into two to eliminate huge disparities in solder pod areas that could cause the larger cathode plate to lift chip and break anode pad connection