GPD Global | https://www.gpd-global.com/pcdpumpseries-underfill.php
Dispense on Flip Chip & BGA, Bumped Silicone Die: Underfill Dispensing Home Products Fluid Dispensing Equipment High Precision Dispenser -MAX Series Large Format Board Dispensing -DS Series Table Top Dispensing Equipment Loader
GPD Global | https://www.gpd-global.com/dispense-flip-chip-bga.php
Dispense on Flip Chip & BGA, Bumped Silicone Die: Underfill Dispensing Home Products Fluid Dispensing Equipment High Precision Dispenser - MAX Series Large Format Board Dispensing - DS Series Table Top Dispensing Equipment Loader
Lewis & Clark | http://www.lewis-clark.com/product-tag/metcal-5000/
: • Max PCB Dimensions 250mm x 230mm • PCB Thickness 0.5 – 2.0mm • Component types BGA, CPS, LGA, Micro SMD, MLF, Bumped chip • Airflow 8-24 LPM • Pre-heater base • Heater element 350W top
Lewis & Clark | https://www.lewis-clark.com/product/ok-international-metcal-apr-5000-array-package-rework-sttion/
: • Max PCB Dimensions 250mm x 230mm • PCB Thickness 0.5 – 2.0mm • Component types BGA, CPS, LGA, Micro SMD, MLF, Bumped chip • Airflow 8-24 LPM • Pre-heater base • Heater element 350W top
Lewis & Clark | http://www.lewis-clark.com/product/ok-international-metcal-apr-5000-array-package-rework-sttion/
: • Max PCB Dimensions 250mm x 230mm • PCB Thickness 0.5 – 2.0mm • Component types BGA, CPS, LGA, Micro SMD, MLF, Bumped chip • Airflow 8-24 LPM • Pre-heater base • Heater element 350W top
Lewis & Clark | http://www.lewis-clark.com/product-tag/rework-station/
: • Max PCB Dimensions 250mm x 230mm • PCB Thickness 0.5 – 2.0mm • Component types BGA, CPS, LGA, Micro SMD, MLF, Bumped chip • Airflow 8-24 LPM • Pre-heater base • Heater element 350W top
Baja Bid | https://bajabid.com/wp-content/uploads/2021/05/MY300-SX-Brochure.pdf
(2.5”) 0.20 mm (8 mil) 0.10 mm (4 mil) Bumped components 63 mm (2.5”) 0.25 mm (10 mil) 0.13 mm (5 mil) LINESCAN VISION SYSTEM - 4K RESOLUTION COMPONENT TYPE FIELD OF VIEW MIN PITCH MIN LEAD WIDTH Leaded components 80 mm (3.1”) 0.10 mm (4 mil) 0.05 mm (2 mil
Lewis & Clark | http://www.lewis-clark.com/product-category/rework-station/
: • Max PCB Dimensions 250mm x 230mm • PCB Thickness 0.5 – 2.0mm • Component types BGA, CPS, LGA, Micro SMD, MLF, Bumped chip • Airflow 8-24 LPM • Pre-heater base • Heater element 350W top
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/industrial-coating-systems/application-solutions/automotive-assembly/power-train
2.5-inch extrude nozzles offer reach inside parts while not limiting valve capability. The breakaway between the nozzle and the valve allows for a part to be bumped and the nozzle to break out of position, preventing damage of the part
Lewis & Clark | http://www.lewis-clark.com/shop/page/17/
: • Max PCB Dimensions 250mm x 230mm • PCB Thickness 0.5 – 2.0mm • Component types BGA, CPS, LGA, Micro SMD, MLF, Bumped chip • Airflow 8-24 LPM • Pre-heater base • Heater element 350W top
