Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/06/fluxless-reflow-1.pdf
. CONFIDENTIAL SAC Solder Reflow Profile CONFIDENTIAL Fluxless Reflow Bumping Formic acid peak concentration 4.27% SEM Micrographs indicate excellent, very smooth results 750X 200X 50X CONFIDENTIAL Fluxless Reflow Bumping Optical Micrographs - Formic acid peak concentration 4.27
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/vacuum-demo-data.pdf
% Voids Heller Vacuum Data - Semiconductor Die Attach Die Attach with Clip at Lead Frame Vacuum Parameters • Pump Rate: 20torr/sec • Dwell: 20 sec @ 10 torr Void Rate • No Vacuum: 30.65% • With Vacuum: 0.34% 30% Voids Low Void (<1%) Normal Reflow Vacuum Reflow Heller Vacuum Data - Semiconductor Bumping Semiconductor Bumping Vacuum Parameters
Heller Industries Inc. | https://hellerindustries.com/semiconductor-advance-packaging/
Semiconductor Advance Packaging - Heller Home » Semiconductor Advance Packaging Semiconductor Advanced Packaging Heller Industries offers multiple solutions for semiconductor advanced packaging applications such as bumping, die attach, underfill
Precision PCB Services, Inc | https://precision-pcb-services-inc.com/products/bga-reballing-service
. Home Catalog Blog About us Home › BGA Reballing Service BGA Reballing Service $25.00 Default Title - $25.00 USD Quantity Add to Cart BGA Reballing services and Solder Bumping services for all types of BGA's, QFN's, LGA's and other SMD devices
Precision PCB Services, Inc | https://precision-pcb-services-inc.com/products/ltm4619v
. Salvaged Components, Untested. Available in Lead or Lead Free finish. With flat pads. Solder bumping available at $10.00 each. Installation is also available at our facility for $125.00 each. 37 chips available. Warranty
Precision PCB Services, Inc | https://precision-pcb-services-inc.com/products/quick-turn-bga-reballing-services-open-during-covid-19-quarantines
! BGA Reballing services and Solder Bumping services for all types of BGA's, QFN's, LGA's and other SMD devices. Price varies depending on chip size and quantity. Phone: (888) 406-2830 Email: dennis@pcb
Heller 公司 | https://hellerindustries.com.cn/semiconductor-advance-packaging/
半导体先进封装 » 半导体先进封装 半导体先进封装 HELLER Industries为半导体先进封装应用提供多种解决方案，如植球（Bumping)、芯片粘接(Die Attach)、底部填充固化(Underfill)、盖子粘接((Lid Attach)和球粘接(Ball Attach)。我们为晶圆、框架晶圆、玻璃面板和其他基板提供多种洁净室等级选项和一系列自动化选项。将您的焊接或固化挑战带给我们，我们经验丰富的工程师随时准备为您提供定制的解决方案。 球粘接(Ball Attach) 典型的球粘
Surface Mount Technology Association (SMTA) | https://www.smta.org/southeast-asia/keynotes.cfm
., ASM Pacific Technology Recent advances in (1) flip chip such as wafer bumping, package substrate, assembly, and underfill, (2) fan-in WLCSP (wafer-level chip scale package
| http://etasmt.com/cc?ID=te_news_bulletin,23566&url=_print
(including toxic gases). Formic Acid has been shown to be an effective reducing agent in fluxless solder reflow Excellent results demonstrated for wafer bumping application in horizontal reflow oven Fluxless reflow utilizes
Precision PCB Services, Inc | https://precision-pcb-services-inc.com/products/quick-turn-bga-rework-service
- $150.00 USD Quantity Add to Cart Quick Turn BGA Rework Services open with offices in Oroville, CA and Dallas, TX to serve you now! BGA Rework, Reballing and Solder Bumping services for all types of BGA's, QFN's, LGA's and other SMD devices
