| https://www.eptac.com/soldertip/soldertips-problems-with-stress-cracks-in-ceramic-components/
. Although it may not be seen at this time, the ceramic will fracture when exposed to heat cycles. Solder paste, Tin/Lead or Lead-Free. Lead-Free is more brittle and the stress relief will be absorbed by the component causing it to crack
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-problems-with-stress-cracks-in-ceramic-components
. Although it may not be seen at this time, the ceramic will fracture when exposed to heat cycles. Solder paste, Tin/Lead or Lead-Free. Lead-Free is more brittle and the stress relief will be absorbed by the component causing it to crack
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes
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ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/sonoscan-applications/microelectronics
: PEM-INST-001 ESA/SCC Spec No.25200 Ceramic Chip Capacitors Discoidals, Filters, MLCCs, etc. Mil-PRF-123, 31033 & 49470 Die Attach Mil-STD-883
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keeps the top surface dry. Frequency Domain Imaging (FDI)™ Nordson SONOSCAN PBGA POPCORN CRACK Nordson SONOSCAN PBGA Popcorn Crack - Application Note 245 PBGA 3D SECTIONED VOIDS Nordson SONOSCAN PBGA 3D Sectioned Voids in Molding Compound - Application Note
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ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/2470-3v-voids-and-cracks
About Us Sonoscan Leadership Company History Locations Patent List News Events Careers Nordson SONOSCAN Home Support Application Notes 3V VOIDS AND CRACKS 3V VOIDS AND CRACKS Ceramic Cutting Tool
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/applications/test-and-inspection?con=t&page=8
: Test and Inspection IGBT Modules Interrogated Acoustically Nordson SONOSCAN POPCORN CRACK Nordson SONOSCAN Plastic Encapsulated Microcircuit (PEM
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