ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes
Popcorn Crack, Through Transmission 1020 Chip On Board Voids 1021 Chip On Board Voids, Through Transmission 1053 PDIP Lead Delaminations on Top 1054 PDIP Lead Delaminations on Bottom 1058 PLCC Lead
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/products/acoustic-inspection-systems?con=t&page=8
PBGA POPCORN CRACK Nordson SONOSCAN PBGA Popcorn Crack - Application Note 245 HEAD SINK AND ADHESIVE Nordson SONOSCAN Flip Chip Heat Sink Attach - Application Note 355 LEAD DELAMINATIONS Nordson
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/sonoscan-applications/microelectronics
: PEM-INST-001 ESA/SCC Spec No.25200 Ceramic Chip Capacitors Discoidals, Filters, MLCCs, etc. Mil-PRF-123, 31033 & 49470 Die Attach Mil-STD-883
| https://www.eptac.com/soldertips/problems-with-stress-cracks-in-ceramic-components/
. If the loose components do crack, then I would start with the manufacturer and supplier. They are starting to see some chip caps that are counterfeit components, so this idea cannot be dismissed and needs to be considered
| https://www.eptac.com/soldertip/soldertips-problems-with-stress-cracks-in-ceramic-components/
. If the loose components do crack, then I would start with the manufacturer and supplier. They are starting to see some chip caps that are counterfeit components, so this idea cannot be dismissed and needs to be considered
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-problems-with-stress-cracks-in-ceramic-components
. If the loose components do crack, then I would start with the manufacturer and supplier. They are starting to see some chip caps that are counterfeit components, so this idea cannot be dismissed and needs to be considered
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/industries/electronics-assembly-and-packaging?con=t&page=9
keeps the top surface dry. Frequency Domain Imaging (FDI)™ Nordson SONOSCAN PBGA POPCORN CRACK Nordson SONOSCAN PBGA Popcorn Crack - Application Note 245 PBGA 3D SECTIONED VOIDS Nordson SONOSCAN PBGA 3D Sectioned Voids in Molding Compound - Application Note
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/industries/automotive-and-transportation?con=t&page=8
& I Solution Center 22 Nordson DAGE ECHOES UP ECHOES DOWN. THE VERSATILITY OF AMI. Nordson SONOSCAN Time Domain Imaging (TDI)™ Nordson SONOSCAN PBGA POPCORN CRACK Nordson SONOSCAN PBGA Popcorn Crack - Application Note 245 PBGA 3D SECTIONED VOIDS Nordson SONOSCAN PBGA 3D Sectioned Voids in Molding Compound - Application Note 210 Waterplume™
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/industries/lighting-and-led?con=t&page=7
: Lighting and LED Gen7 Nordson SONOSCAN FLIP CHIP Nordson SONOSCAN Flip Chip disbonded solder bumps and halo defects - Application Note 354 Publications Nordson SONOSCAN Click on the links below to
