Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
@nordsondage.com ABSTRACT The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion
Surface Mount Technology Association (SMTA) | https://www.smta.org/store/book_store.cfm
| $310.00 International Wafer-Level Packaging Conference (IWLPC) 2018 Proceedings Download Sponsored jointly by the SMTA and Chip Scale Review magazine, the 15th annual IWLPC brought together some of the semiconductor industry's most respected authorities
KD Electronics Ltd. | http://www.kundasmt.com/?A-Equipment-Accessories/6006.html
LONG W10,5/H5,1/O-L12 00316791-01 SLIDING PLATE 00316802-01 COMP.MAGAZINE LONG TRANSFORMER SC-1 00316805-02 MAGAZINE LONG SOJ32 00316823-03 LP illumination camera UP 00316831-01 Micro switch V4N T7 series 00317167-01 DIN 125-A 1,7-140HV-A2 00317195-01 Micro fuse
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