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) Conductor lifted from board or substrate. (b-5) Fracture within board or substrate. c. For flip-chip configurations: (c-1) Failure in the bond material or pedestal, if applicable. (c-2) Fracture of die (or carrier) or substrate
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) Conductor lifted from board or substrate. (b-5) Fracture within board or substrate. c. For flip-chip configurations: (c-1) Failure in the bond material or pedestal, if applicable. (c-2) Fracture of die (or carrier) or substrate