Partner Websites: cold joint (Page 1 of 12)

5 Common Solder Mistakes and How to Resolve Them - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/5-common-solder-mistakes-and-how-to-resolve-them/

. 4. Cold Solder Joint A cold solder joint occurs when the solder does not melt completely. A result of insufficient heat, cold joints are often characterized by being rigid, rough, and uneven in appearance

PCB Libraries Forum : To Neck or Not to Neck, That is the Question

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_to-neck-or-not-to-neck-that-is-the-question_topic2025.xml

. You might think that large traces might conduct heat away from the solder joint producing a cold solder joint. But I learned back in 1982 from senior PCB designers that a cold solder joint can only be produced by a copper area larger than the size of a USA Quarter $0.25 - 0.955 inches (24.26 mm

PCB Libraries, Inc.

5 Common Solder Mistakes and How to Resolve Them

| https://www.eptac.com/blog/5-common-solder-mistakes-and-how-to-resolve-them

.   4. Cold Solder Joint A   cold solder joint   occurs when the solder does not melt completely. A result of insufficient heat, cold joints are often characterized by being rigid, rough, and uneven in appearance

To Neck or Not to Neck, That is the Question - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/to-neck-or-not-to-neck-that-is-the-question_topic2025.html

. You might think that large traces might conduct heat away from the solder joint producing a cold solder joint. But I learned back in 1982 from senior PCB designers that a cold solder joint can only be produced by a copper area larger than the size of a USA Quarter $0.25 - 0.955 inches (24.26 mm

PCB Libraries, Inc.

To Neck or Not to Neck, That is the Question - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/to-neck-or-not-to-neck-that-is-the-question_topic2025_post8320.html

. You might think that large traces might conduct heat away from the solder joint producing a cold solder joint. But I learned back in 1982 from senior PCB designers that a cold solder joint can only be produced by a copper area larger than the size of a USA Quarter $0.25 - 0.955 inches (24.26 mm

PCB Libraries, Inc.

Dépose - Matières froides et adhésifs | Systèmes de dépose d'adhésif Nordson

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/fr-FR/divisions/adhesive-dispensing-systems/applications/dispensing-cold-materials-and-adhesives?con=t&page=20

précision hot melt et les systèmes d'application d'adhésif, de joint et de revêtement pour une large gamme de produits… Recherche de documentation Adhesive Dispensing Systems Recherchez des fiches techniques

ASYMTEK Products | Nordson Electronics Solutions

Dépose - Matières froides et adhésifs | Systèmes de dépose d'adhésif Nordson

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/fr-FR/divisions/adhesive-dispensing-systems/applications/dispensing-cold-materials-and-adhesives?con=t&page=5

. L’investissement initial et les coûts de possession sont réduits grâce à… Electroménager/produits blancs Adhesive Dispensing Systems Systèmes de dépose d'adhésif hot melt, de colle froide ou de joint

ASYMTEK Products | Nordson Electronics Solutions

Will I Damage a Wire-In-Board if it is Bent Too Far - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/ask/will-i-damage-a-wire-in-board-if-it-is-bent-too-far/

. My question is, can I just move these wires (cold, not reheat) to the position we want and not damage the wire in the area of the solder joint

PCB Libraries Forum : IPC-7351 SMD & PTH Reference Calculators

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_ipc7351-smd-pth-reference-calculators_topic785.xml

;A PTH lead with a direct connection to a GND or VCC Plane can have a cold solder joint because the plane can dissipate all the heat from that connection. ID

PCB Libraries, Inc.

Lead-free Reflow Soldering Machine-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com/cc?ID=te_news_bulletin,14961&url=_print

. The standard of 30g / in2 is usually used in the design. The third method is to blow cold air in the lower part of the furnace, so that the solder joint temperature at the bottom of the PCB can be maintained below the melting point in the second reflow soldering

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