| https://unisoft-cim.com/exports_xml-definition.html
.xml format by having the Unisoft software support the multitude of ever changing and new CAD and Gerber systems. The .xml file exported normally contains component reference designator names, pin numbers, part numbers, netlists, net names, trace runs, pin x/y, via x/y, board layers, device type SMD/THD, board outline
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/pqfn-pson-footprint-name_topic305.html
“ The minimum board edge to any feature - component, via, trace, copper pour is 40 mils (1.0 mm)”. I have a hard time with IPC spec’s and where to find out things like that. I have been using .040 for planes and .020 for traces
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/pqfn-pson-footprint-name_topic305_post2178.html
“ The minimum board edge to any feature - component, via, trace, copper pour is 40 mils (1.0 mm)”. I have a hard time with IPC spec’s and where to find out things like that. I have been using .040 for planes and .020 for traces
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/pqfn-pson-footprint-name_topic305_post2179.html
: 5375 Post Options Post Reply Quote Tom H Report Post Thanks(0) Quote Reply Posted: 27 Oct 2012 at 8:02am The minimum board edge to any feature - component, via, trace, copper pour is 40 mils (1.0 mm
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic305&OB=DESC.html
“ The minimum board edge to any feature - component, via, trace, copper pour is 40 mils (1.0 mm)”. I have a hard time with IPC spec’s and where to find out things like that. I have been using .040 for planes and .020 for traces
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic305&OB=ASC.html
: 5449 Post Options Post Reply Quote Tom H Report Post Thanks(0) Quote Reply Posted: 27 Oct 2012 at 8:02am The minimum board edge to any feature - component, via, trace, copper pour is 40 mils (1.0 mm
Imagineering, Inc. | https://www.pcbnet.com/capabilities/fabrication/tolerances/
″ over finished hole size for vias and + 0.012″ over finished hole size for component holes. This means the annular ring (radius of the pad) should be at least
| http://etasmt.com/cc?ID=te_news_bulletin,23571&url=_print
• Improper pad trace • Improper solder mask application • Via in pad draining solder from connection • Trace with solder mask over it running under component causing a fulcrum effect on the component
| https://unisoft-cim.com/cad-to-cad_cad-export-samples.html
) elements such as reference designators, netlist, netnames, pin numbers, pin XY positions, surface location, device type SMD/THD, component xy center positions, component rotations, trace run segments
| https://unisoft-cim.com/cad-file-visual-comparison.html
) for example pin data, reference designators, traces, component outlines, etc. At this point discrepancies should stand out, for example in the figure below circled in yellow with the pointer is a red trace run on PCB assembly ( PCBA
.gif)
