Imagineering, Inc. | https://www.pcbnet.com/blog/how-pcbs-are-made/
. Common types of surface finishes are: HASL (Hot Air Solder Leveling): A cost-effective finish that enhances solderability and protects copper. ENIG
Imagineering, Inc. | https://www.pcbnet.com/blog/understanding-the-pcb-fabrication-process-from-design-to-delivery/
. Using gold and palladium also makes ENEPIG an expensive option for a finish. Standard hot air solder leveling (HASL) is cost-effective, long-lasting, and reworkable
Imagineering, Inc. | https://www.pcbnet.com/blog/the-role-of-pcb-assembly-and-fabrication-in-the-aerospace-industry/
with immersion gold coating (ENIG) and immersion silver. Hot air solder leveling (HASL) is a type of PCB finish that involves dipping the PCB into molten solder, which covers exposed copper surfaces. The PCB is then passed between hot air knives to
Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc
. Immersion silver surface finish eliminated due to corrosion risk Alternative finish must meet ICT and solderability requirements Investigate several alternatives (OSP, ImSn, ENIG, and LF HASL) PCB laminate may change from what was used on DT and NB products
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
. However, the high tensile strength of AuSn20, not to mention its cost, limits its use to smaller die only. The high conductivity of metal is due to the majority contribution of electronic phonons rather than lattice vibrations
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
: An Exercise in Technically Sound Cost Reduction Bruce M. Misner Abstract 29-3 Evaluation of Reworkable Edge Bond and Corner Bond Adhesives for BGA Applications Fei Xie, Han Wu, Kelley Hodge, Swapan K
Surface Mount Technology Association (SMTA) | https://www.smta.org/education/presentations/presentations.cfm
? Check the knowledge base. Webinar vs Webtorial: What's the Difference? Free Webinars (4 per year!) One session lasting 60 minutes Cost
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. Sn - Osp manual electroplating w/post-cleaning + dryer Laif Cu & Tn Pattern Plate Electroplating Line PVA Tepla Plasma-Etch System Hot Air Levelling Laif HASL Pre-Clean Line Cemco Quicksilver Hot Air Leveller lead free Pola e Massa HASL post-cleaning Artwork
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) Advanced Plasma Systems (APS) PWB-8-209 Etchback System w/ Spare Pump IS PUMEX-PUMIFLEX 2000 Series Scrubbing System Lantronic TT30 Lead-Free Hot Air Solder Leveler (HASL
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
. Analysis of the thermal cycle results revealed that there was no statistically significant difference between the void and void-less solder joint populations for the 144 I/O BGA components (Figure 4). Figure 4
