ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/0245-pbga-popcorn-crack
PBGA POPCORN CRACK ACOUSTIC Products Corporate | Global Directory Division Only All of Nordson Home Products/Instruments View All Products LABORATORY ● Gen7 ● Gen6 ● D9600 ● D9600Z PRODUCTION ● FastLine P300 ● Facts2 DF2400
| https://www.eptac.com/wp-content/uploads/2014/09/eptac_09_17_14.pdf
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/0309-tsop-die-cracks
Note 309 Optical image of a TSOP, diagram showing defect, Acoustic image of large crack, Acoustic image showing a smaller crack. Sample & Method Two TSOPs were imaged on C-SAM from the top side
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/1012-pbga-popcorn-cracks
About Us Sonoscan Leadership Company History Locations Patent List News Events Careers Nordson SONOSCAN Home Support Application Notes PBGA POPCORN CRACKS PBGA POPCORN CRACKS PBGA Popcorn Crack
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/2602-c-sam-and-q-bam
. The cross-sectional Q-BAM image was made along the horizontal line drawn through the questionable area. The cross-sectional view in the top half of the Q-BAM image shows that the "questionable" feature is actually a crack in the molding compound
| https://www.eptac.com/soldertips/problems-with-stress-cracks-in-ceramic-components/
. Although it may not be seen at this time, the ceramic will fracture when exposed to heat cycles. Solder paste, Tin/Lead or Lead-Free. Lead-Free is more brittle and the stress relief will be absorbed by the component causing it to crack
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/products/acoustic-inspection-systems?con=t&page=8
DIE AND LEAD DELAMINATIONS Nordson SONOSCAN SOIC Die and Lead Delamination - Application Note 1086 IRREGULARITIES AND VOIDS Nordson SONOSCAN Microfluidics Channel Defects - Application Note 2158 PBGA POPCORN CRACKS Nordson SONOSCAN PBGA Popcorn Crack, Through Transmission - Application Note 1012
| https://www.eptac.com/soldertip/soldertips-problems-with-stress-cracks-in-ceramic-components/
. Although it may not be seen at this time, the ceramic will fracture when exposed to heat cycles. Solder paste, Tin/Lead or Lead-Free. Lead-Free is more brittle and the stress relief will be absorbed by the component causing it to crack
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-problems-with-stress-cracks-in-ceramic-components
. Although it may not be seen at this time, the ceramic will fracture when exposed to heat cycles. Solder paste, Tin/Lead or Lead-Free. Lead-Free is more brittle and the stress relief will be absorbed by the component causing it to crack
