ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/0245-pbga-popcorn-crack
. Some of the delaminations extend from the edge of the package to the area of the popcorn crack. In This Section Support Imaging Modes AMI Overview AMI Glossary FAQs Application Notes Standards Publications Literature Search Webinars Seminars Workshops Training Workshops Custom Programs Service
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/0309-tsop-die-cracks
. Gating was at the interface between the die and the die attach layer. Result Both examples exhibit cracks in the die. The die crack in the package at lower left above is large and complex
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/1012-pbga-popcorn-cracks
. The package at lower left has a large “popcorn crack”. Popcorn cracks are typically caused by the expansion of retained humidity during the reflow process
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/2602-c-sam-and-q-bam
. The cross-sectional Q-BAM image was made along the horizontal line drawn through the questionable area. The cross-sectional view in the top half of the Q-BAM image shows that the "questionable" feature is actually a crack in the molding compound
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/0306-smart-card-cracked-die
. Result The die in this Smart card has been cracked and the symmetry of the crack suggests that the cracking occurred as a result of improper handling during assembly
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/imaging-modes
. This image shows a popcorn crack in a PEM where the brightness of the feature relates to depth. The brighter the feature the closer it is positioned to the package surface (reference
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/industries/medical-life-science-and-pharmaceutical?con=t&page=8
: Medical, Life Science and Pharmaceutical Acoustic Impedance Polarity Detector (AIPD)™ Nordson SONOSCAN Hidden Trouble in a BGA Package Nordson SONOSCAN Special Values Nordson SONOSCAN Historic Savings Opportunity
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes
Plastic ICs/PEMs Flex Circuit Smart Card Bonded Wafers Chip Scale Package Flip Chip Hybrid Ceramic Solar Cells Packaging, Seals Materials Other Plastic ICs/PEMs
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/0434-pqfp-production-scanning
. The most intense reflections are red and are represented here by a single PQFP package in the top row. High resolution permits the magnification of this package as shown in the inset
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/sonoscan-applications/microelectronics
–Method 2030 Chip Scale Package (CSPs) Flip Chips Stacked Dies Ball Grid Arrays (BGAs, CBGAs) Tape Automated Bond (TAB) Mil-STD-883–Method 2035 Hybrids, MCMs, SIPs Flex Circuits Printed Circuit Boards (PCB
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