| http://etasmt.com/cc?ID=te_news_industry,3561&url=_print
. Pb also acts as a solvent metal that facilitates the formation of intermetallic bonds between the joint constituents, e.g., Sn and Cu (from the leadframe of the device package
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf
), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/pan_APEX06-1.pdf
), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305
| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_12_17_08.pdf
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5246
The Role of Nickel in Solder Alloys - Part 2. The Effect of Ni on the Integrity of the Interfacial Intermetallic in Sn-Based/Cu Substrate Solder Joints 中文
| http://etasmt.com:9060/te_news_industry/2013-03-29/3561.chtml
. Pb also acts as a solvent metal that facilitates the formation of intermetallic bonds between the joint constituents, e.g., Sn and Cu (from the leadframe of the device package
| http://etasmt.com/te_news_industry/2013-03-29/3561.chtml
. Pb also acts as a solvent metal that facilitates the formation of intermetallic bonds between the joint constituents, e.g., Sn and Cu (from the leadframe of the device package
| https://www.eptac.com/wp-content/uploads/2007/10/webinar_eptac_10_17_07.pdf
| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_10_17_07.pdf
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Vacuum-Fluxless-Reflow-Technology-for-Fine-Pitch.pdf
: contacting point of Cu and Sn; σCS: surface tension between Cu and Sn; σCF: surface tension between Cu and flux; σSF: surface tension between Sn and flux; W: Sn weight; θ