Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc
experiments in this study were performed on an OSP finished board. Finishes such as OSP which do not have a nickel later represent the worst case scenario with respect to Cu dissolution. An OEM server product was used as the test vehicle throughout this study
Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote-usa/?cpn=2
. Special introductory offer applies to new customers only. One offer per company . Valid company name required. Limited Time Offer. PCB Specifications View Matrix Part Number * Revision Quantity * Thickness 0.062" 0.078" 0.093" 0.125" Layers
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf
% Sn finish OSP over Cu pad Sn63Pb37, Type 3 powder, No-clean flux 1206, 0805, 0603, 0402 all 100% Sn finish HASL SnPb over Cu pad The test vehicle designed is shown in Figure 1
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/pan_APEX06-1.pdf
% Sn finish OSP over Cu pad Sn63Pb37, Type 3 powder, No-clean flux 1206, 0805, 0603, 0402 all 100% Sn finish HASL SnPb over Cu pad The test vehicle designed is shown in Figure 1
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/leadfree.pdf
• How well does it work? • What do I have to do differently? • What profile shape, peak temperature, liquidous time? • What atmosphere, air or nitrogen
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/leadfree.pdf
• How well does it work? • What do I have to do differently? • What profile shape, peak temperature, liquidous time? • What atmosphere, air or nitrogen
Surface Mount Technology Association (SMTA) | https://www.smta.org/education/presentations/presentations.cfm
US Eastern Time Presenter: Vincent C. Pascucci, TE Connectivity’s Aerospace, Defense, and Marine Business Unit Co-Hosted by Overview Since the 1980s there has been enormous growth in the use of electronic devices which has driven similar, if not greater, growth in the number of electrical interconnects
Surface Mount Technology Association (SMTA) | https://www.smta.org/webinars/
: Proposed Testing Protocols to Align Connector Reliability with Application Requirements Free for Everyone! Tuesday, June 16 @ 11:00am US Eastern Time Presenter
| http://www.thebranfordgroup.com/dnn3/Auction/TSLE0523.aspx
. Sn - Osp manual electroplating w/post-cleaning + dryer Laif Cu & Tn Pattern Plate Electroplating Line PVA Tepla Plasma-Etch System Hot Air Levelling Laif HASL Pre-Clean Line Cemco Quicksilver Hot Air Leveller lead free Pola e Massa HASL post-cleaning Artwork
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