Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5246
The Role of Nickel in Solder Alloys - Part 2. The Effect of Ni on the Integrity of the Interfacial Intermetallic in Sn-Based/Cu Substrate Solder Joints 中文
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5495
. The excellent Cu wire-bonding reliability was obtained in no corrosion at the Ni-P surface. The factors influencing corrosion of the electroless Ni-P surface were found to be additives in Pd plating bath, plating area of pad on the substrate, and liquid flow in the electroless Pd plating bath
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/wedge-shear?con=t&page=5
images upon completion. Micro Testing Thin Die Nordson DAGE Creep testing of Tin Based Alloys Application Note Nordson DAGE Cu Pillar Application Note Nordson DAGE High Strain Rate Nordson DAGE Nordson DAGE bondtesters
ORION Industries | http://orionindustries.com/pdfs/X300-series.pdf
FR-1 as their insulating substrate. ORION’s EM materials are available in combinations with a variety of shielding metals. Their excellent dielectric strength and formability make them the ideal choice for a wide range of electrical and electronic applications. CONFIGURATION: ORION®
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/die-shear?con=t&page=2
the tool above the substrate. Testing is similar to standard ball shear tests and is performed in accordance with: MIL STD 883 Low profile die shear testing is required when the die under test are very thin and their height profile is low relative to the surface that they are bonded to
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/passivation-layer-shear?con=t&page=5
. Micro Testing Thin Die Nordson DAGE Creep testing of Tin Based Alloys Application Note Nordson DAGE Battery BondTesting blind spot Nordson DAGE Cu Pillar Application Note Nordson DAGE High Strain
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/first-bond-ball-pull-stud-bump-pull?con=t&page=2
. Nordson DAGE has been at the forefront of such testing since its… Nordson DAGE UV Curing App Note Nordson DAGE Bump Shear Nordson DAGE Nordson DAGE Bondtesters provide bump shear testing for use in the production test environment to remove the solder ball from a device or substrate
ORION Industries | http://orionindustries.com/pdfs/X700-series.pdf
FR-700 as their insulating substrate. ORION’s EM materials are available in combinations with a variety of shielding metals. Their excellent dielectric strength and formability make them the ideal choice for a wide range of electrical and electronic applications
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/zone-shear?con=t&page=5
. Products Content Your results for: Zone Shear Creep testing of Tin Based Alloys Application Note Nordson DAGE Cu Pillar Application Note Nordson DAGE High Strain Rate Nordson DAGE Nordson DAGE bondtesters provide high strain rate testing (up to 5kg
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