ORION Industries | http://orionindustries.com/pdfs/X300-series.pdf
: White Insulating Layer Finish: Matte or Polish Standard Roll Widths: up to 48” wide Standard Gauges (insulating layer): 0.005”, 0.010”, 0.015”, 0.020”, 0.030” Available Foils: Aluminum, Copper, Tin Plated Copper
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/industrial-coating-systems/additional-product-sub-type/manual-spray-guns?con=t&page=27
electrostatic spray guns are affordable, robust, lightweight, easy-to-use and deliver high transfer efficiency for the perfect paint finish
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/industrial-coating-systems/additional-product-sub-type/manual-electrostatic-spray-guns?con=t&page=30
leading manual electrostatic spray guns are affordable, robust, lightweight, easy-to-use and deliver high transfer efficiency for the perfect paint finish
ORION Industries | http://orionindustries.com/pdfs/X700-series.pdf
• Component Wrapping • Ground Straps Film Color: Black Insulating Layer Finish: Matte or Polish Standard Roll Widths: up to 48” wide Standard Gauges (insulating layer): 0.010”, 0.017”, 0.030” Available Foils
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
. Abstract 32-2 The Study of Dissolution of Bi Precipitates in Sn Using a Novel In Situ Heating Technique in the SEM Peter Banh, André M. Delhaise, Doug D. Perovic Abstract 32-2 Tin Whisker Formation in Bismuth-Containing Lead-Free Solder Alloys After Long-Term Ambient Temperature, High Humidity Storage, Part I
| https://www.eptac.com/faqs/ask-helena-leo/page/8
: We install D-Paks on a number of boards (8.3.14 in IPC-A-610). These parts have a tendency to float during reflow. We have done quite a bit of process work to minimize the floating, but parts do still occasionally float and are
| https://ipcapexexpo.org/education/call-for-technical-paper-form
2.5-D/3-D Component Packaging BGA Packaging Connectors Design for Excellence (DFX) Design for Manufacturability (DFM) Design for Test (DFT) Die attach Embedded Passive and Active Devices Flexible Circuits Flip Chip/0201 Metric Package on Package Printed Electronics RFID Circuitry Re-balling Components Semiconductor Wire Bonding Other
Surface Mount Technology Association (SMTA) | https://www.smta.org/hutchins/hutchins.cfm
? Chemical Engineer, Honeywell FM&T 2016 Thomas Reeve , Purdue University Paper: "Heterogeneous Nucleation of ß-Tin in Lead-Free, Tin-Based Solder Alloys" Where is he now
